Sun Microsystems, Inc.

Oracle America, Inc.

David Hockanson

Istvan Novak

Sergiu Radu

Leesa Noujeim

John E Will

Rodney D Slone

Ron Zhang

Bidyut Kanti Sen

Deviprasad Malladi

Larry D Smith

Steven R Boyle

George C Zacharisen

Charlotte E Stoutamire

A stable power, low electromagnetic interference (EMI) apparatus and method for connecting electronic devices and circuit boards is disclosed. The apparatus involves a capacitor which includes a body member, a set of power terminals and a set of ground terminals connected to the top of the body member. The set of power terminals and the set of ground terminals alternate one with another. As a result of this configuration, a high inductance on the PCB side is achieved. The capacitor further includes a set of terminals connected to the bottom of the body member and includes metal planes within the body member. The metal planes are positioned to electrically connect either the set of power terminals or the set of ground terminals to the set of terminals.

Power integrity circuits with EMI benefits

An interconnect system between an integrated circuit device and a printed circuit board may include a filter between the integrated circuit device and the power subsystem of the printed circuit board. The filter may be a low-pass filter that reduces current in a higher frequency range without negatively modifying current in a lower frequency range and may reduce radiated emissions produced during operation of the integrated circuit. The filter may be implemented by arranging core-power voltage conductors and ground conductors at a first or second level interconnect into one or more voltage groupings and one or more adjacent ground groupings such that series inductance is increased. In some embodiments, the first level interconnect may include conductive bumps or pads between an integrated circuit and a substrate. In some embodiments, the second level interconnect may include solder balls, pins, pads, or other conductors of a package, socket, or interposer.

Interconnect design for reducing radiated emissions

An interconnect system between an integrated circuit device and a printed circuit board may include a filter portion coupled to conductors on a power distribution bus. The filter portion may reduce radiated emissions produced during operation of the integrated circuit. The interconnect may include dispersive elements. The dispersive elements may be less electrically conductive of current in a higher frequency range than in a lower frequency range. In some embodiments, the second level interconnect may include a socket having dispersive contacts. The contacts may be coupled to core power conductors on the power distribution bus.

Dispersive interconnect system for EMI reduction

An integrated circuit package includes EMI containment features. The EMI containment features may include a plurality of pins on a substrate of the integrated circuit package. The pins may be a peripheral row of pins in an array of pins. The pins may couple a lid of the package to at least one ground plane of a circuit board.

EMI grounding pins for CPU/ASIC chips

An electromagnetic shielding structure is provided for a microprocessor or other electronic device that emits electromagnetic radiation. The structure includes a heat sink with an integrally formed depending skirt, and a conductive, compressible polymer is applied to a bottom surface of the skirt. The bottom surface mounts against a socket carried on a circuit board and is electrically coupled to a ground plane of the circuit board. The socket substantially surrounds the microprocessor in at least two dimensions (e.g. length and width). A shielding structure is formed at least partly by the heat sink, the socket and the ground plane.

EMI shielding apparatus

A system and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model. In one embodiment, a method for determining the decoupling capacitors for a power distribution system includes creating a model of the power distribution system using circuit simulation software, such as SPICE. The power distribution system model includes a plurality of cells interconnected at predetermined nodes. The method then selects one or more decoupling capacitors for the power distribution system. The decoupling capacitors are represented in the power distribution system model by a capacitor model, which is a mathematical model of an electrical circuit. The electrical circuit upon which the capacitor model is based is a ladder circuit. Following the selecting of the decoupling capacitors, the power distribution system model is update based on the selections, and operation of the power distribution system is then simulated. During the simulation, transfer impedance values are determined for each of the nodes, and compared to target impedance. The method is then repeated until each of the transfer impedance values is at or below the target impedance.

System and method for determining the required decoupling capacitors for a power distribution system using an improved capacitor model

An integrated circuit package comprising EMI containment features. The EMI containment features include a first EMI containment configuration and a second EMI containment configuration. The second EMI containment configuration is disposed around the first EMI containment configuration. The first and second EMI containment configurations include vias coupled to at least one ground plane of the integrated circuit package.

Growing community of inventors

Boulder Creek, CA, United States of America

David Hockanson