Dow Corning Corporation

David Ha

Brian Harkness

Dorab Edul Bhagwagar

Kai Su

Craig Rollin Yeakle

Ronald Paul Boisvert

Stelian Grigoras

Sarah Nicol

Craig Yeakle

Ronald Boisvert

A thermally conductive grease includes 2 vol % to 15 vol % of a combination of three polyorganosiloxanes and 65 vol % to 98 vol % of a thermally conductive filler. The grease may be used as a thermal interface material for dissipating heat from (opto)electronic devices, in both TIMand TIMapplications.

Thermally conductive grease and methods and devices in which said grease is used

Silicone resins comprising 5 to 50 mole % of (PhSiO(OH)) units and 50 to 95 mole % (HSiO(OH)), where Ph is a phenyl group, x has a value of 0, 1 or 2 and wherein the cured silicone resin has a critical surface free energy of 30 dynes/cm or higher. These resins are useful as etch stop layers for organic dielectric materials having a critical surface free energy of 40 dynes/cm or higher.

Etch-stop resins

Growing community of inventors

Midland, MI, United States of America

David Ha