Lexmark International, Inc.

Ikeyless, LLC

Other

Funai Electric Company Ltd.

David Golman King

Patrick Laurence Kroger

George Keith Parish

Randall David Mayo

Lucas David Barkley

Kristi Maggard Rowe

Michael Anthony Marra, Iii

Bruce David Gibson

Douglas Lawrence Robertson

Adam Pizer

Eric Spencer Hall

Jon Determann

Daniel Charles Johnson

Barry Baxter Stout

John Glenn Edelen

Andrew McNees

Timothy Lowell Strunk

David L Bernard

Robert Henry Muyskens

Paul William Dryer

Steven Wayne Bergstedt

Kent Lee Ubellacker

Jason McReynolds

Stephen Kelly Cunnagin

Stephen Todd Olson

Colin G Maher

Paul W Graf

Alexander Lloyd Chapman

Prabuddha Jyotindra Mehta

Eric Todd Debusschere

Robert Edward Miller, Jr

Carrie A Klusek

Charles Aaron Judge

The present invention provides a system, method, and apparatus for pairing a vehicle key or remote keyless entry device with a vehicle by a dongle connected to an OBD port of the vehicle. The OBD programming dongle operates without a connection to an external device and pairs one or more keys with a vehicle without user intervention after the pairing process has started. The OBD programming dongle may be linked to a specific vehicle by the VIN code of the specific vehicle.

System and method for pairing a key with a vehicle via a vehicle communications port by a dongle

System and  method for pairing a key with a vehicle via a vehicle communications port by a dongle

A micro-fluid ejection head assembly and methods for fabricating micro-fluid ejection heads using separately fabricated electrical components. The micro-fluid ejection head has at least one base substrate, at least one fluid ejector actuator substrate attached to the base substrate; and at least a first logic component substrate hermetically sealed to the base substrate. The fluid ejector actuator substrate and the first logic component substrate are in electrical communication with each other.

Modular micro-fluid ejection head assembly

Printheads configured to operate in accordance with a plurality of print modes. For example, one of the plurality of print modes can be selected in accordance with a bit of address data received by the printhead. In an exemplary embodiment, the selection of print mode can be accomplished by switching one or more actuator (e.g., heater) circuit addresses on the printhead.

Printhead having a plurality of print modes

Methods and apparatuses for optimizing the energy supplied to a print head heater are disclosed. A resistance associated with the print head heater or actuator is determined. A range of fire pulse values is determined based at least in part on the determined resistance and a velocity optimization procedure is executed based at least in part on the determined range of fire pulse values. An optimal fire pulse for the print head heater is selected based at least in part on the results of the velocity optimization procedure.

Methods and apparatus for optimizing energy supplied to a print head heater

Test circuits on heater chips for testing a heater circuit having a heater element and a first power device. The test circuit can include a second power device, a test device configured to hold the first power device off and the second power device on for a selected heater circuit when the test device receives a signal to activate the test circuit, and a common test output to transmit a signal indicative of a state of the selected heater circuit. Methods for using the same are also provided.

Heater chip test circuit and methods for using the same

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor.

Methods and apparatuses for sensing temperature of multi-via heater chips

A heater chip for use in a printing device that includes a first heater array with a left side and a right side and a first ink via placed on the left side of the first heater array. The chip also includes a second heater array with a left side and a right side, where a right side of the first heater array faces the left side of the second heater array, a second ink via placed on the right side of the second heater array, and at least one logic array is disposed between the first heater array and the second heater array.

Methods and apparatuses for implementing multi-via heater chips

Heater chips for use with a printing device, such as heater chips that include a first heater array, positioned substantially adjacent a first via, and a second heater array, positioned substantially adjacent a second via. The heater chip can also include a region, positioned between the first heater array and the second heater array, and a temperature sensing element operable to sense the temperature of the region, where the temperature sensing element is substantially centrally disposed with respect to the region. Additionally, the first heater array and the second heater array are operable to receive heating responsive to the temperature of the region sensed by the temperature sensing element to regulate the temperature of the region. According to one embodiment of the invention, the temperature sensing element comprises a temperature sensing resistor and the heating may occur via non-nucleating heating.

Methods and apparatuses for regulating the temperature of multi-via heater chips

Methods and systems for calibrating media indexing errors in a printing device are provided. In one embodiment, the method comprises feeding a calibration media through a printing device, sensing the position of the media as it moves through the printing device, sensing positions of a media indexing component as the media moves through the printing device, determining media indexing position errors based upon the sensed positions, and calculating a compensation factor to be applied based upon the errors. In some embodiments, parameters of a line and/or other function are determined from the error data and the parameters are utilized to calculate a compensation factor. Moreover, in some embodiments, it is determined what range the data fits within, and a predetermined compensation factor is determined based upon the range.

Methods and systems to calibrate media indexing errors in a printing device

A semiconductor substrate for a micro-fluid ejection device. The substrate includes plurality of micro-fluid ejection actuators disposed adjacent a fluid supply slot in the semiconductor substrate. A plurality of power transistors, occupying a power transistor active area of the substrate, are disposed adjacent the ejection actuators and are connected through a first metal conductor layer to the ejection actuators. An array of logic circuits, occupying a logic circuit area of the substrate, is disposed adjacent the plurality of power transistors and is connected through a polysilicon conductor layer to the power transistors. A power conductor and a ground conductor for the ejection actuators is routed in a second metal conductor layer. The power conductor overlaps at least a portion of the power transistor active area of the substrate and the ground conductor overlaps at least a portion of the logic circuit area of the substrate.

Power and ground buss layout for reduced substrate size

Heater chips for use in printing devices, such as those including one or more ink vias and one or more heater arrays, where at least a portion of at least one the ink vias is associated with at least portions of at least two heater arrays. The first heater array can be adjacent to one side of at least a portion of the ink via and a second heater array can be adjacent to another side of at least a portion of the ink via. The heater chip can also include a bondpad supplying power to at least a portion of the first heater array and to at least a portion of the second heater array.

Heater chips with a reduced number of bondpads

A method for determining ink drop velocity of a printhead located at a gap above a print medium. A first ink mark is printed at a first printhead velocity. A second ink mark is printed at a different (in magnitude and/or direction) second printhead velocity. The ink for the second ink mark is ejected from the printhead at the same print ejection position used for the first ink mark plus an offset distance (if any). An optical scan of at least a portion of the print medium is generated using a non-printhead-carrier-mounted optical scanner. The distance between the ink marks is measured using the optical scan. The ink drop velocity is calculated using the measured distance, the offset distance, the first and second printhead velocities, and the gap.

Method for determining ink drop velocity of carrier-mounted printhead using an optical scanner

A printhead alignment test pattern has spaced-apart images at least partially aligned along an axis. Each image includes leading and trailing edge portions having respective image-outermost leading and trailing edges spaced apart along the axis and includes an intervening portion located between the leading and trailing edge portions. The leading and trailing edge portions have a higher print density than the intervening portion. A method for determining a printhead misalignment of a printer prints the test pattern, moves a sensor along the axis over the images, obtains data from the sensor, determines the locations along the printhead scan axis of the leading and/or trailing edges of the images using the data, and calculates the printhead misalignment from the determined locations of the leading and/or trailing edges of the images. The test pattern reduces cockling of the print media which improves the accuracy of the method.

Growing community of inventors

Shelbyville, KY, United States of America

David Golman King