Electro Scientific Industries, Inc.

David Gillen

Adrian Boyle

Maria Farsari

Eva Fernandes Gomez

Richard Toftness

A surface of a workpiece () to be laser machined is protected by a surfactant film () form debris () produced during machining with a laser beam () by reducing adherence to the surface of debris produced by the laser machining. The surfactant film is preferably subsequently removed together with debris () deposited thereon.

Laser machining using a surfactant film

A die bonding method and apparatus by which a wafer substrateadhered to a carrier tapeby an adhesive layeris laser machined through the wafer substrate and through the adhesive layer at most to scribe the carrier tape to form a singulated diewith an attached singulated adhesive layer, without substantial delamination of the adhesive layerand carrier tapeor substantial production of burrs from the adhesive layer. The carrier tapeis cured, preferably by ultraviolet light, to release the adhesive layer from the carrier tape. The singulated die is picked and placed on a die pad and the adhesive layeris cured, preferably by heat, to adhere the die to the die pad.

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Clontarf, Ireland

David Gillen