Hampshire Instruments, Inc.

Blackstone Automation, LLC

David Gardner Baker

Robert David Frankel

Thomas L Duft

Patrick Michael Guida

Michael D Ryan

Laurie A Smith

Marc J Martin

A rowing machine or rowing machine attachment with an energy absorbing component configured to add responsive and compliant roll, pitch, and yaw motions to the rowing machine. The energy absorbing component is also configured to change shape so as to absorb energy in response to a compressive force by the user. Said energy absorption component returns substantially to its first shape in response to the removal of the compressive force. The energy-absorbing apparatus is configured to reduce a reaction force exerted on the user of the rowing machine.

Energy absorbing suspension equipment (EASE) for rowing machines

A pin chuck holds a wafer during translation by an X-ray lithography machine. The chuck is designed to be the same size as the wafer and includes a plurality of extensions having tops along a common plane. The space between the extensions is evacuated to hold and level the wafer. In order to load or remove a wafer from the pin chuck, three extendable posts are provided which can be extended to permit a robot arm to position a wafer thereon for lowering to the pin chuck or remove a wafer therefrom lifted from the pin chuck. The three posts are triangularly positioned within a space sufficient to hold the wafer which at the same time close enough together to permit the fingers of the robot arm to fit therearound.

Pin chuck for lithography system

A step and repeat mechanism is used with an X-ray lithography system for moving a wafer to be exposed from position to position beneath the source of x-rays. The step and repeat mechanism includes, means for moving the wafer to be exposed with six degrees of freedom. Conventional drive motor means move the step and repeat mechanism, and wafer held thereby, in the X, Y and Z linear directions, as well as rotates, tip and tilt the wafer in the planar direction. In addition, the system includes, three fine Z motor assemblies for moving the wafer in fine increments in the Z direction, which motor assemblies are used to tip and tilt the plane of the wafer. Sensors are included for determining the plane of the mask and the plane of each of the various sections of wafer to be exposed, so that appropriate tip and tilt adjustments by the three fine Z motor assemblies can be made to cause the average plane of each section of the wafer to be exposed to be parallel to the plane of the mask. All of the moving mechanisms, with the exception of the Y direction moving mechanism, are affixed the same level of the step and repeat mechanism. Included in the mechanism is a substage plate which is adjusted by the three triangularly positioned fine Z motor assemblies.

Gap sensing/adjustment apparatus and method for a lithography machine

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Shrewsbury, MA, United States of America

David Gardner Baker