Motorola Corporation

David Galloway

Michael S Lebby

Christopher K Chun

Davis H Hartman

Shun-Meen Kuo

Brian A Webb

Barbara M Foley

Ronald E Thomas

Robert M Wentworth

Garland D Cotney

A waveguide (12) having a core region (16) and a cladding region (20) is formed. A portion of the cladding region (20) forms a first surface (21) and portions of both the core region (16) and the cladding region (20) forms an end surface (15). An insulative flexible substrate (14) having an electrically conductive tracing (32) with a first portion and a second portion, wherein the first portion of the insulative flexible substrate (14) is mounted on the end surface of the waveguide (12).

Optoelectronic interconnect device and method of making

An optical package including a housing defining a mounting area with leads formed in the housing each having a first end in the mounting area and a second end external to the housing. A semiconductor die with photonic devices thereon is mounted in the mounting area and electrically connected to the leads. The active light areas of the photonic devices is accessible through the mounting area. Optical fiber alignment structure is mounted in the mounting area for receiving optical fibers and aligning the optical fibers with the active light areas of the photonic devices.

Optical package and method of making

A first cladding region (12) having a first surface and a second surface is formed. The first surface (18) having a first core region extending on the first surface (18) and the second surface (19) having a second core region extending on the second surface (19). A second cladding region (13) having a third surface (17) with the third surface (17) affixed on the first surface (18) of the first cladding region (12). A third cladding region (11) having a fourth surface (21) with the fourth surface (21) of the third cladding region (11) affixed to the second surface (19) of the first cladding region (12).

Optical waveguide module and method of making

A method for making an optical interconnect unit is disclosed. A mold (100) with surface (107) having a groove (112) is formed. An optical fiber (117) is placed into the groove (112) of the surface (107). A molding material is applied onto the surface (107) of the mold (100) and onto the optical fiber (117), thereby affixing the optical fiber (117) to the molding material.

Optical interconnect unit and method or making

An optical interface including a base with molded optical waveguides and overmolded electrical conductors, with a keyway formed therein. A keyway mating portion molded around the ends of a plurality of optical fibers to expose the ends of the fibers. With the keyway mating portion engaged in the keyway, openings in a surface of the keyway communicate light to/from the fibers, through the optical waveguides, from/to semiconductor devices on the base. The keyway accurately aligns the mating portion which aligns the ends of the fibers with the openings and, hence, the optical waveguides. Two different waveguide molding techniques are used and diffraction gratings are used to introduce and/or receive light from the ends or mid-points of the waveguides.

Growing community of inventors

Tempe, AZ, United States of America

David Galloway