Sunpower Corporation

Maxeon Solar Pte. Ltd.

Total Marketing Services

Gaf Energy LLC

David Fredric Joel Kavulak

Thomas Pass

Richard Hamilton Sewell

Gabriel Harley

Taeseok Kim

Benjamin I Hsia

Lewis C Abra

Matthieu Moors

Nils-Peter Harder

Alex Sharenko

Robert Woehl

Mohamed A Elbandrawy

Nathan Peterson

William Sirski

Hamsini Gopalakrishna

Peter John Cousins

Richard Perkins

Caleb David Cheung

Andrea R Bowring

Matthieu Minault Reich

Benjamin Francois

Boris Bastien

Raphael M Manalo

Thomas P Pass

Approaches for fabricating one-dimensional metallization for solar cells, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate and parallel along a first direction to form a one-dimensional layout of emitter regions for the solar cell. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes a plurality of metal lines corresponding to the plurality of alternating N-type and P-type semiconductor regions. The plurality of metal lines is parallel along the first direction to form a one-dimensional layout of a metallization layer for the solar cell.

One-dimensional metallization for solar cells

A system includes a plurality of roofing shingles having a core layer and a cap layer, with first and second ends of the cap layer offset from respective first and second ends of the core layer. The cap layer includes a first surface and a pattern on the first surface. A side lap extends from the second end of the cap layer to the second end of the core layer and an extended portion is located at the first end of the cap layer. The extended portion of a first one of the roofing shingles overlays the side lap of a second one of the roofing shingles. The system further includes a plurality of photovoltaic modules, each of the plurality of photovoltaic modules include at least one solar cell.

Roofing shingle and method of manufacturing same

Some embodiments of the present disclosure relate to photovoltaic module for use on a roof. In some embodiments, the photovoltaic module may include a solar cell and a polymeric continuous fiber tape. In some embodiments, the polymeric continuous fiber tape comprises a polymer and glass fiber. In some embodiments, the glass fiber is present in an amount greater than about 50% by weight based on a total weight of the polymeric continuous fiber tape. In some embodiments, the polymeric continuous fiber tape comprises an elastic modulus greater than 1 GPa and an optical transmission greater than 80%.

Photovoltaic module for a roof with continuous fiber tape

A solar cell can include a first plurality of metal contact fingers, and a second plurality of metal contact fingers interdigitated with the first plurality of metal contact fingers, wherein at least one of the first plurality of metal contact fingers comprises a wrap-around metal finger that passes between a first edge of the solar cell and at least one contact pads. A photovoltaic (PV) string including a solar cell with a wrap-around metal contact finger. A method of coupling an electrically conductive connector to a solar cell with a wrap-around metal contact finger.

Solar cell with wraparound finger

A solar cell can include a conductive foil having a first portion with a first yield strength coupled to a semiconductor region of the solar cell. The solar cell can be interconnected with another solar cell via an interconnect structure that includes a second portion of the conductive foil, with the interconnect structure having a second yield strength greater than the first yield strength.

Solar cell interconnection

Approaches for fabricating foil-based metallization of solar cells based on a leave-in etch mask, and the resulting solar cells, are described. In an example, a solar cell includes a substrate having a back surface and an opposing light-receiving surface. A plurality of alternating N-type and P-type semiconductor regions is disposed in or above the back surface of the substrate. A conductive contact structure is disposed on the plurality of alternating N-type and P-type semiconductor regions. The conductive contact structure includes metal foil portions in alignment with corresponding ones of the alternating N-type and P-type semiconductor regions. A patterned wet etchant-resistant polymer layer is disposed on the conductive contact structure. Portions of the patterned wet etchant-resistant polymer layer are disposed on and in alignment with the metal foil portions.

Leave-in etch mask for foil-based metallization of solar cells

Laser foil trim approaches for foil-based metallization of solar cells, and the resulting solar cells, are described. For example, a method of fabricating a solar cell includes attaching a metal foil sheet to a surface of a wafer to provide a unified pairing of the metal foil sheet and the wafer, wherein the wafer has a perimeter and the metal foil sheet has a portion overhanging the perimeter. The method also includes laser scribing the metal foil sheet along the perimeter of the wafer using a laser beam that overlaps the metal foil sheet outside of the perimeter of the wafer and at the same time overlaps a portion of the unified pairing of the metal foil sheet and the wafer inside the perimeter of the wafer to remove the portion of the metal foil sheet overhanging the perimeter and to provide a metal foil piece coupled to the surface of the wafer.

Laser foil trim approaches for foil-based metallization for solar cells

Approaches for the foil-based metallization of solar cells and the resulting solar cells are described. A method involves patterning a first surface of a metal foil to provide a plurality of alternating grooves and ridges in the metal foil. Non-conductive material regions are formed in the grooves in the metal foil. The metal foil is located above a plurality of alternating N-type and P-type semiconductor regions disposed in or above a substrate to provide the non-conductive material regions in alignment with locations between the alternating N-type and P-type semiconductor regions and to provide the ridges in alignment with the alternating N-type and P-type semiconductor regions. The ridges of the metal foil are adhered to the alternating N-type and P-type semiconductor regions. The metal foil is patterned through the metal foil from a second surface of the metal foil at regions in alignment with the non-conductive material regions.

Thick damage buffer for foil-based metallization of solar cells

Growing community of inventors

Fremont, CA, United States of America

David Fredric Joel Kavulak