Cambridge Consultants Limited

International Business Machines Corporation

Matsushita Electric Industrial Co., Ltd.

The University of Tokyo

British Technology Group Limited

Cambridge University Technical Services Limited

Genomic Solutions Acquisitions Limited

David Frank Moore

Robert Jones

Roger Mark Bostock

Peter Gravesen

Narito Shibaike

Karen H Brown

Kasper Mayntz Paasch

Stuart Antony Elmes

Bernard J Van Der Hoeven, Jr

Alan Heaver

William Ireland Milne

Andrew Charles Hoole

Heather Klaubert

Martin Clement Davies

Stuart Clyde Burgess

Takashi Kiriyami

Hiang-Swee Chiang

A dropping tool for transferring drops of a liquid onto a substrate wherein a surface of the dropping tool for contact with the liquid has a first region which exhibits an affinity to the liquid to be transferred directly surrounded by a second region which exhibits a lower affinity to the liquid to be transferred than the first region; the topography of the first and second regions and the relative affinities of the first and second regions for the liquid to be transferred being selected such that when the dropping tool is dipped into and then removed from a source of the liquid to be transferred, the liquid adheres to the first region without substantially any adherence of the liquid to the second region. A dropping tool for transferring drops of liquid onto a substrate, the dropping tool comprising a tip, at least one surface tapered towards the tip, and a capillary channel which leads from a position of the tapered surface remote from the tip to a reservoir located within the dropping tool. A method for transferring drops of liquid carried on a dropping tool onto a substrate to form an ordered array of drops thereon wherein the drop of liquid is transferred without contacting the dropping tool with the substrate either directly or indirectly via the drop of liquid.

Liquid transfer system

The present case concerns the manufacture of hybrid electrooptical chips. A substrate is treated so that it can both provide locations for electrooptical components and be etched so as to generate grooves in which optical fibers can be mounted. During the etching of the grooves any electrooptical component already mounted on the substrate is protected from damage by the etchant by a protective coating. A feature is that optical fibers can be mounted with their cores above the surface of the wafer.

Hybrid chip process

Miniature mounting device and method

Micromechanical accelerometer

A micromechanical sensor has a plurality of sensing elements (14a-14d) which are supported at respective support regions (12a-12d). A first set of the sensing elements defines the sensing gap. In one arrangement this is defined by sensing elements supported by adjacent support regions. In another embodiment the sensing gap is defined between one sensing element and a reference beam formed by connection of the return legs of two diametrically opposed sensing elements. The sensing elements are substantially similar one to another and each sensing element comprises an outgoing elongate leg extending away from its associated support region and a return leg substantially parallel to the outgoing leg extending towards the support region. By providing sensing elements which are substantially similar in shape and arranged in this way, the effects of thin film stress are minimized.

Micromechanical sensor

This composite back-etch/lift-off stencil method avoids the uncontrolled changes in the properties of contacts in small devices caused by the close proximity of the lift-off resist stencil to the contact area during the precleaning, surface preparation and metal deposition processes. This method limits the area of the wafer exposed to back-etching and thus restores the freedom of choice of contact metallurgy. Back-etching is only applied in the areas of the wafer near to the contact holes; lift-off techniques are used for the rest of the integrated circuit.

Composite back-etch/lift-off stencil for proximity effect minimization

Growing community of inventors

Cambridge, United Kingdom

David Frank Moore