Analog Devices,inc.

Invensense, Inc.

Analog Devices International Unlimited Company

Analog Devices Global Unlimited Company

David Frank Bolognia

Vikram Venkatadri

Kieran P Harney

Brian W Hall

Weidong Wang

Aleksey Sergeyevich Khenkin

Chee Wah Cheung

Kelvin Po Leung Pun

Alain Valentin Guery

Brian Moss

Jiawen Bai

Jochen Schmitt

Patrick Stanley Riehl

Scott Robert Davis

Alfonso Berduque

Evgueni Vladimirovich Ivanov

Tony Joseph Akl

Venugopal Gopinathan

Liam Patrick Riordan

J Brian Harrington

Youri Ponomarev

Camille Louis Huin

Roberto Munoz

Christophe Antoine

Aileen Anne Cleary

Krishnan Ramaswamy Parameswaran

Carlos Calvo

Christopher W Hyde

Xu Tang

Hari Chauhan

Claire E Leahy

Michael Alan Falter

Ying-Ju Wang

Jingwen Zhu

Michelle A Farrington

A sensor module is disclosed. The sensor module can include a housing body that is disposed about a cavity that is sized and shaped to receive a container in which a substance is disposed in an operational configuration of the sensor module. The sensor module can include a first electrode that is coupled to or formed with the housing body. The first electrode is disposed at a first peripheral position on the housing body. The sensor module can include a second electrode that is coupled to or formed with the housing body. The second electrode is disposed at a second peripheral position on the housing body that is opposite the first peripheral position. The cavity is disposed between the first and second electrodes in the operational configuration of the housing body.

Sensor module

A gas sensor is disclosed. The gas sensor can include a housing that has an upper portion and a lower portion. The gas sensor can also include a chamber that is formed in the lower portion of the housing. The chamber can be configured to receive an electrochemical solution. The gas sensor can also include a plurality of electrodes that are formed in the upper portion of the housing. The plurality of electrodes can be molded in the upper portion of the housing and at least partially exposed to the chamber. The gas sensor can further include an access port that is formed in the upper portion. The access port can be configured to provide fluid communication between the an interior of the housing and the outside environs. The gas sensor can be a system-in-package (SiP) sensor.

Electrochemical device

Health monitor device with sensors

A fluid sensor device can include a housing having an inlet and an outlet. The housing can have a fluid reservoir, a sensing assembly, a plunger, a valve, and a plurality of channels. The fluid sensor module can be used to sense constituents in a sample fluid (e.g. patient's blood or dialysate) during a treatment process, such as kidney dialysis procedures. The fluid sensor module can be connected in-line to a medical device to sense the sample fluid.

Fluid sensor module

A flow meter is disclosed. The flow meter can include a housing that has a cavity. The flow meter can also include a deformable tube that is disposed in the cavity. The deformable tube can comprise a portion of a flow path of a fluid substance. The flow meter can further include a cam that is rotatably coupled to the housing. A portion of the cam is configured to press against a portion of the collapsible tube so as to deform the portion of the collapsible tube. The cam can be configured to rotate in response to a flow of the fluid substance in the flow path.

Fluid control system

A battery assembly is disclosed. The battery assembly can include a first electrode disposed in a first substrate section and a second electrode disposed in a second substrate section. The battery assembly can also include an adhesive that bonds the first substrate section to the second substrate section. The adhesive partially defines a chamber between the first and second electrodes. The battery assembly can also include an electrolyte disposed in the chamber between the first and second electrodes.

Battery assembly and method of manufacturing the same

A substance delivery device is disclosed. The substance delivery device includes a lever that includes a drive arm that is rotatable about a pivot. The substance delivery device also includes a pump that has a deformable chamber. The deformable chamber is configured to rotate the drive arm about the pivot towards a container so as to deform the container to drive a fluid substance from the container.

Fluid delivery device

An array of optical filters having a front side and a back side is disclosed. The array of optical filters includes first and second optical filters and a molding compound. The first and second optical filters each include a substrate having a back surface coplanar with the back side of the molding compound, and a filter layer having a front surface coplanar with the front side of the molding compound. The molding compound covers the sidewalls of the filter substrates and filter layers, and fills gaps between the filters.

Thin optical filter arrays

An electronic module is disclosed. The electronic module can include a package substrate, an integrated device die, a dam structure, and a mounting compound. The integrated device die can have an upper side, a lower side, and an outer side edge. The dam structure can have a first sidewall and a second sidewall opposite the first sidewall. The second sidewall can be nearer to the outer side edge than the first sidewall. The first sidewall can be laterally positioned between a center of the lower side of the integrated device die and the outer side edge. The dam structure can be disposed between a portion of the package substrate and a portion of the lower side of the integrated device die. The mounting compound can be disposed between the lower side of the integrated device die and the package substrate. The dam structure can be positioned between the mounting compound and the outer side edge of the integrated device die.

Negative fillet for mounting an integrated device die to a carrier

An integrated device package sized and shaped to fit in a small space, such as within a body lumen or cavity of a human patient, is disclosed. The integrated device package includes a package substrate and integrated device dies. The first and second integrated device dies are angled relative to one another about the longitudinal axis by a fixed non-parallel angle.

Compact integrated device packages

An electronic device is disclosed. The electronic device comprise an elongate electrical connector that is configured to connect to an integrated device package. The elongate electrical connector can comprise an elongate flexible substrate. The elongate flexible substrate has a proximal portion and a distal portion spaced from the proximal portion by a length along a longitudinal axis. The elongate flexible substrate has a width along an axis transverse to the longitudinal axis. The elongate flexible substrate defines an elongation ratio of the length to the width. The elongation ratio is at least 100:1. The elongate electrical connector can be connected to a bobbin. The elongate electrical connector can be configured to unspool from the bobbin.

Electronic devices

A sensor package is disclosed. The sensor package can include a housing that at least partially defines a flow channel. The sensor package can also include an electrically conductive spacer that is disposed on a surface of the housing in the flow channel. The sensor package can further include a sensor die that is disposed in and exposed to the flow channel. The sensor die electrically attached to the spacer such that the sensor die is elevated relative to the surface of the housing.

Sensor package

A device is disclosed. The device includes a housing that defines a chamber. The chamber is to be at least partially filled with an electrolyte material. The device also includes a plurality of electrodes that are at least partially embedded in the housing and exposed to the chamber. The device further includes an access port that provides fluid communication between an interior of the housing and the outside environs.

Device with chemical reaction chamber

According to one example configuration, an apparatus enhances functionality of a mobile communication device. The apparatus includes an encasement in which to retain the mobile communication device and supplemental circuitry. The supplemental circuitry is operable to: i) control an optical transmitter in the supplemental circuitry to irradiate matter under test, ii) monitor attributes of an optical signal reflected off the matter under test and received by the optical receiver; and iii) communicate the attributes of the optical signal from the supplemental circuitry to the mobile communication device over a communication link. The supplemental circuitry optionally includes multiple electrodes to further monitor attributes of the matter under test.

Smartphone companion device material sensing and improved phone performance

In one aspect, an electric coil structure is disclosed. The electric coil structure includes a magnetic core and a substrate. The substrate comprises a conductive material that is embedded in an insulating material. The substrate has a first portion and a second portion and the first portion of the substrate is wrapped around the core. The substrate can have a first portion having a plurality of contacts and a second portion having a corresponding plurality of edge contacts. The coil structure includes an alignment structure. The alignment structure can facilitate attachment of the first portion to the second portion to define a coil about the magnetic core. The alignment structure can comprise a redistribution substrate. The redistribution substrate can be disposed between the first portion and the second portion with the conductive material of the first portion electrically connected to the conductive material of the second portion through the redistribution substrate to define at least one winding. The alignment structure can include an adhesive. The adhesive can be disposed in the recess electrically connecting the first and second portions to define at least one winding. The coil structure can include a solder joint. The solder joint can be disposed between the plurality of contacts and the corresponding plurality of edge contacts making electrical connections between the first and second portions to define at least one winding such that the solder joint is exposed on the first portion.

Growing community of inventors

North Andover, MA, United States of America

David Frank Bolognia