Cyberoptics Corporation

Harman International Industries, Inc.

Other

David Fishbaine

Eric P Rudd

David M Kranz

Steven K Case

Timothy A Skunes

Paul R Haugen

Jeffrey A Jalkio

John P Konicek

Seth D Burgett

Carl E Haugan

Richard J Daniels

Michael D Wetle

Thomas L Volkman

Brian D Cohn

Theodore Paul Dale

David D Madsen

David W Duquette

Thomas W Bushman

John D Gaida

Tonya An

Bharat Rajaram

Todd D Liberty

Scott D Roth

Carl E Haugen

Brant O Buchika

Adam Reinhardt

An ear measurement system and method include obtaining an image of an ear and an associated a calibration device, and analyzing the image to determine the size of desired portions of the ear. Such sizing is then used, for example, for fitting an earbud or earbud adapter.

Ear sizing system and method

A system and method for providing earpieces for a user includes an inventory of standard earpieces having a plurality of different parameters, and a device for making a non-contact measurement of the user's ear, such as a camera or scanner. An ear-piece is selected from the inventory based on the non-contact measurement of the user's ear.

Earpiece system

A manufacturing method and system are disclosed for illuminating a target. A light controller has a plurality of pixels, and light is projected from at least a first light source to the light controller, wherein the light from the first light source is incident on the light controller at a first angle. The pixels are controlled to establish illumination characteristics for first and second optical paths between the light controller and the target.

Inspection system and method

Improved component placement inspection and verification is performed by a pick and place machine. Improvements include stereovision imaging of the intended placement location; enhanced illumination to facilitate the provision of relatively high-power illumination in the restricted space near the placement nozzle(s); optics to allow image acquisition device to view the placement location from an angle relative to a plane of the placement location, thereby reducing the possibility of such images being obstructed by the component; techniques for rapidly acquiring images with commercially available CCD arrays such that acquisition of before and after images does not substantially impact system throughput; and image processing techniques to provide component inspection and verification information.

Pick and place machine with component placement inspection

A high-speed image acquisition system includes a source of light; a sensor for acquiring a plurality of images of the target; a system for determining relative movement between the source and the target; and an image processor for processing the acquired images to generate inspection information relative to the target. The system has an extended dynamic range provided by controlling illumination such that the plurality of images is acquired at two or more different illumination levels. In some embodiments, the high-speed image acquisition system is used to perform three dimensional phase profilometry inspection.

High speed optical image acquisition system with extended dynamic range

A novel inspection system for inspecting an article of manufacture, such as a printed circuit board, is disclosed, where the system includes a strobed illuminator adapted to project light through a reticle so as to project a pattern of light onto an area of the printed circuit board. A board transport responsively positions the board to at least two distinct positions, where each position corresponding to a different phase of the projected light. Also included is a detector adapted to acquire at least two images of the area, each image corresponding to one of the at least two different phases. An encoder monitors the movement of the board and outputs a position output, and a processor connected to the encoder, the board transport, the illuminator and the detector controlledly energizes the illuminator to expose the area as a function of the position output, the processor co-siting the at least two images and constructing a height map image with the co-sited images.

Solder paste inspection system

An automated system includes improved height sensing. In one aspect, a on-head camera performs the dual functions of fiducial imaging and height sensing using an auxiliary off-axis light source and triangulation. In another aspect, an on-head height sensor is positioned to measure height at a location that is not beneath any nozzles. The sensor provides height information at a plurality of locations over the board, and a height map of the board is created. In yet another aspect of the invention, the above features are combined to provide an on-head camera that images fiducials and measures height at a plurality of locations such that a height map is created.

Automated system with improved height sensing

An optical system for computing a height of a target on a surface includes a light projector for projecting light. The light passes through a patterned reticle and a projector lens so as to illuminate the target with an image of the pattern. The light is projected telecentrically between the reticle and the projector lens, and a camera is positioned along a receive optical path. The camera receives an image of the target through a receive lens. The target and the pattern move at least three times with respect to each other, and the camera acquires an image of the object at each of at least three positions.

Phase profilometry system with telecentric projector

Methods and an apparatus are disclosed for providing enhanced vibration immunity in a solder paste inspection system, although they are usable in any number of industries that require rapid acquisition of several images. The method includes capturing at least three images on a frame transfer CCD array before any data is sequentially read from the array. The present method is extendable to a larger number of images. Additionally, the masked memory area can be larger than the image area of the frame transfer CCD array.

Inspection system with vibration resistant video capture

The system of the present invention reports a signal related to a physical condition of an object, such as an electronic component, with the most basic realization of the system including a vacuum quill for releasably holding the object and a motion control system for rotating the quill. The invention includes control electronics coupled to the detector for providing a trigger signal where the detector is oriented to view a stripe in a viewing plane perpendicular to the central axis of the quill, and to provide an image of the stripe. The control electronics sends a plurality of trigger signals to the detector while the motion control system rotates the quill, with each trigger signal triggering the acquisition of another image of a stripe. A processing circuit processes the plurality of images of the stripes to provide the signal related to the physical condition of the object, which can include the orientation or location of the component, the presence or absence of balls on a ball grid array, the height of a specific lead on a leaded component, the distance between the leads on a leaded component or the coplanarity of features on the component. A method for picking and placing components is also disclosed for use with the apparatus of the present invention.

Rotary sensor system with a single detector

A computer implemented software device for estimating background tilt and offset is disclosed to preferably be adaptable to an optical measurement instrument wherein the estimated parameters are resolved to generate a reference plane to be subtracted from a height map of a phase profile. A set of histograms of heights is used to develop a merit function. A two-dimensional high speed iterative search is used to optimize the merit function to generate a reference plane coincident with the spatial tilt of the phase profile. The invention enables real-time measurement of substrate height for preferred use in high-speed image processing operations relating to circuit-board production lines.

Apparatus and method for estimating background tilt and offset

The present invention includes a system for providing a signal related to a physical condition of an object, such as an electronic component. Various types of electronic components may be used with the present invention, including leaded components, column, pin or grid array packages, and the like. The system includes a quill for releasably holding the object. The object has a major surface defining a plane, and a motion control system for rotating the quill about a central axis. Control electronics in the invention provide a plurality of trigger signals to each of two detectors, each detector adapted to view the same stripe in the plane upon receipt of a trigger signal and to output an image of the stripe. The detectors view a plurality of stripes while the motion control system rotates the quill, and the output from the detectors is received by processing circuitry for processing the plurality of images of the stripes to provide the signal related to the physical condition of the object. The signal may be computed to provide the orientation of the object, the location of a feature on the object, the distance between leads on a leaded component or the coplanarity of raised features on the object. A method of picking and placing components is also disclosed for use with the apparatus of the present invention.

Rotary sensor system with at least two detectors

An apparatus for three dimensional imaging using multi-phased structured light. Measurement of dimensions as small as two hundred microns within one percent accuracy is possible, and multiple scans of a target object, such as the solder pads on an electronic circuit board substrate, are not required. A light source, having a pair of synchronized lamps and a specially designed reticle, projects two different phases of structured light onto a target object. The two phases are projected nearly instantaneously, and the detector is able to discriminate between the two exposures presented by the two out of phase illuminations. The method for presenting the three dimensional image uses filtering techniques and certain assumptions to resolve intensity equations having three unknowns from the two exposures of out of phase structured light.

Method and apparatus for three dimensional imaging using multi-phased

A high speed, high precision laser-based semiconductor lead measurement system for use on surface mount component placement machines. A multi-beam laser system is used to accurately sense the position and condition of each of the many leads used on integrated circuits prior to their placement on a surface mount circuit board by a pick and place machine. Using two, three or four laser beams, the non-contact sensor system can, with the highest degree of resolution, determine lateral orientation, height, colinearity, and coplanarity of leads for integrated circuit components, even those having an ultra-fine pitch. Determination of the lead position by the invention is based on the integrated circuit leads occluding the light of one or more precisely directed and focused laser light sources. Each integrated circuit lead is passed nominally through the focal point of a laser beam. The position of each lead is determined when it blocks all or a portion of the light of the laser beam. A processor means is used to calculate the actual position of each lead. The difference between the actual position of the lead and the nominal position of the lead can then be computed. The position of each lead is then sorted to determine the greatest deviation of any lead from a best fit line or from the Seating Plane. The processor may then either generate a reject or a repositioning signal to the component placement machine for proper placement of the integrated circuit upon the surface mount circuit board.

Growing community of inventors

Minnetonka, MN, United States of America

David Fishbaine