Gm Global Technolgoy Operations, Inc.

Other

David F Nelson

Gregory S Smith

George John

James Michio Nagashima

Terence G Ward

George R Woody

David Yuang Tang

Gabriel Gallegos-Lopez

Edward P Yankoski

Peter James Savagian

Brooks S Mann

Eric R Ostrom

Karl David Conroy

Tilak Gopalarathnam

A power converter assembly is provided. The power converter assembly includes first, second, and third power modules. The second power module is coupled to the first power module such that the second power module is separated from the first power module by a first distance. The third power module is coupled to the first and second power modules such that the third power module is separated from the second power module by a second distance and is separated from the first power module by a third distance. The first, second, and third distances are substantially the same.

Power converter assembly with symmetrical layout of power modules

A subcomponent is provided for a power inverter module. The apparatus comprises a capacitor having a terminal and integrated into a housing. A substrate is mounted on the housing. The substrate incorporates a power semiconductor switch and has at least one direct current (DC) tab. The direct current tab is directly connected to the terminal of the capacitor.

Capacitor with direct DC connection to substrate

A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die; and control circuitry mounted on the substrate and electrically coupled to the gate drive circuitry.

Power electronics devices with integrated control circuitry

A power switch apparatus includes a substrate; a semiconductor die mounted on the substrate and including power electronics circuitry for a high power, alternating current motor application; and gate drive circuitry mounted on the substrate and electrically coupled to the power electronics circuitry on the semiconductor die.

Power electronics devices with integrated gate drive circuitry

An automotive power inverter is provided. The power inverter includes a chassis, a microelectronic die coupled to the chassis and having an integrated circuit formed thereon, and an insulating region between the chassis and the microelectronic die.

Automotive power inverter with reduced capacitive coupling

A cooling device is provided for liquid cooling a power semiconductor device. The device includes a coolant diverter for guiding liquid coolant to the power semiconductor device. The coolant diverter has a first plate for dividing the coolant diverter into a first cavity and a second cavity. The second cavity positioned adjacent the power semiconductor device. The first plate further includes an opening to fluidly couple the first cavity with the second cavity such that the liquid coolant flows into the first cavity, through the opening in the first plate, and into the second cavity to cool the power semiconductor device. The first cavity has a cross-sectional area that generally decreases in a downstream direction, and the second cavity has a cross-sectional area that generally increases in the downstream direction.

Cooling systems for power semiconductor devices

Cooling systems and methods are provided for an integrated electric motor-inverter, where the integrated electric motor-inverter includes a housing, a motor, and an inverter, the motor and the inverter are disposed within the housing, and the motor includes a stator. The system includes a cooling jacket, a first coolant, a condenser, a spray head, and a second coolant. The cooling jacket is disposed concentric to the stator and includes an inner wall and an outer wall. The inner wall is in direct contact with the stator. The first coolant is disposed between the cooling jacket inner and outer walls. The condenser is disposed concentric to the cooling jacket. The spray head is disposed adjacent the inverter. The second coolant is in flow communication with the spray head.

Cooling systems and methods for integration electric motor-inverters

A cooling system is provided for use in conjunction with a semiconductor assembly including a first semiconductor device and a second semiconductor device electrically coupled to the first semiconductor device by an elongated electrical connection. The cooling system includes a flow passage, a pump fluidly coupled to the flow passage, and an outlet array fluidly coupled to the flow passage and configured to direct a coolant fluid over the second semiconductor device. The outlet array has an interconnect feature formed therein configured to receive the elongated electrical connection there through.

Semiconductor cooling system for use in electric or hybrid vehicle

A semiconductor module comprises a housing having a cavity therein, and at least one semiconductor device residing within the cavity. A cooling system is contained within the housing and comprises a dielectric fluid disposed within the housing and a flow passageway disposed through the housing. The flow passageway is fluidly coupled to the cavity, and the cooling system is configured to circulate the dielectric fluid through the flow passageway and onto the at least one semiconductor device.

Growing community of inventors

Redondo Beach, CA, United States of America

David F Nelson