Lam Research Corporation

Elite E/m, Inc.

David Erskine

Gerald Z Yin

Randall S Mundt

Vernon W Wong

Dariush Rafinejad

Fred E Latimore

Zafar Parvez

The test head manipulator comprises two bearings coupled to a frame. A lead screw is rotatably disposed between the two bearings. A non-translation mechanism is also provided to prevent the lead screw from translating along its longitudinal axis. A lead nut is threaded onto the lead screw, but is prevented from rotating about the longitudinal axis by a non-rotation mechanism. A carriage configured to couple with an electronic test head is coupled to the lead nut by means of a system of cables and pulleys. Therefore, when the lead screw is rotated, the lead nut translates along the longitudinal axis, moving the cables and translating the carriage and test head along a vertical path. The lead screw and nut are non-backdrivable to lock the carriage in position.

Test head manipulator

A wafer clamping mechanism includes a clamp ring having a central opening corresponding to the geometry of a conventional semiconductor wafer. An overhang located about the opening engages the corresponding semiconductor wafer when in place on an electrode of a plasma reactor. The clamp ring is resiliently mounted on a housing which holds a second electrode. The clamp ring is automatically engaged against the wafer as the spacing between the two electrodes is adjusted to a desired gap width. A raised annular barrier on the lower electrode circumscribes the wafer and engages a mating surface on the clamp ring in order to enhance alignment of the clamp.

Method and system for clamping semiconductor wafers

Growing community of inventors

Mountain View, CA, United States of America

David Erskine