International Business Machines Corporation

David Erle Houser

Francis S Poch

Richard Jay Morenus

Frank Daniel Egitto

Voya Rista Markovich

David John Russell

Luis Jesus Matienzo

Elizabeth F Foster

Donald W Henderson

Edward Frank Helinski

Raymond Thomas Galasco

Jeffrey Alan Knight

Stephen Wesley MacQuarrie

James M Larnerd

Thomas E Kindl

John Thomas Legg

Amarjit S Rai

Candido C Tiberia

William T Wike

Mark L Janecek

David Martin Dewey-Wright

Daniel C Webster, Deceased

Jeffrey L Lee

Donald Frederick Carter

Edward Joseph Burke

Konstantinos I Papathomas

Donald Seton Farquhar

Anilkumar Chinuprasad Bhatt

Edwin Lorimer Thomas

Ashwinkumar C Bhatt

Gerald Walter Jones

John A Welsh

Thomas P Gall

Thomas P Duffy

Jeffrey McKeveny

Harold Kohn

Joseph Duane Kulesza

James Steven Kamperman

Robert Douglas Edwards

Kenneth J Lubert

Kenneth Lynn Potter

Pamela Lulkoski

Jonathan Craig Whitcomb

James A Veasaw

Warren R Wrenner

Paul S Gursky

Clifford M Balliet, Jr

Gordon L Williams

Richard C Frisbie

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer includes a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, a rectangular channel, or a combination thereof.

Fabrication of a metalized blind via

A movable spindle tool machine, such as a printed circuit board line drilling machine includes a base and a spindle mounted to the base. A magazine is mounted proximate the spindle for storing a supply of tools. A pitch independent tool changer is moveably mounted relative to the base for transferring tools from the magazine for insertion into the spindle. A tool locator is mounted in line with the spindle. The tool changer is operable to initially transfer a tool from the magazine to the tool locator to align the tool with the spindle and thereafter transfer the tool to the spindle for insertion into the spindle. The spindle is mounted to a nested outrigger guide. A positioning system can move two or more spindles simultaneously. A bit detector in a pressure foot button uses fiber optics to detect broken bits.

Variable pitch spindle line drilling machine

A method and structure for forming a metalized blind via. A dielectric layer is formed on a metallic layer, followed by laser drilling a depression in the dielectric layer such that a carbon film that includes the carbon is formed on a sidewall of the depression. If the laser drilling does not expose the metallic layer, then an anisotropic plasma etching, such as a reactive ion etching (RIE), may be used to clean and expose a surface of the metallic layer. The dielectric layer comprises a dielectric material having a carbon based polymeric material, such as a permanent photoresist, a polyimide, and advanced solder mask (ASM). The metallic layer includes a metallic material, such as copper, aluminum, and gold. The carbon film is in conductive contact with the metallic layer, and the carbon film is sufficiently conductive to permit electroplating a continuous layer of metal (e.g., copper) directly on the carbon film without need of an electrolessly plated layer underneath the electroplated layer. The laser drilling is accomplished using a laser radiation having a wavelength between about 180 nanometers and about 600 nanometers. The depression may have any cross-sectional shape and any spatial distribution of depths. As an example, the depression may include a blind via, then the blind via may have any cross-sectional shape, such as circular or non-circular, a rectangular channel, or a combination thereof.

Wire bond packages which mount encapsulated semiconductor chips, such as plastic ball grid array (PBGA) packages providing for the mounting of so-called flip-chips. The chips are overlaid with heat spreading perforated cap wherein the perforations are filled with an adhesive to prevent delamination caused by mismatches in the coefficients of thermal expansion, resulting in contractions which cause the entire package arrangement to warp, leading to delamination between an encapsulant and cap and resulting in failure of connect joints and the ball grid arrays.

Flip chip package with improved cap design and process for making thereof

The present invention provides a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation during conventional profiling, is removed or pre-profiled to off-set the leading edge of the plated through hole from a surface of the circuit board.

Circuit board having burr free castellated plated through holes

A method for conductively filling a hole or via disposed in an electronic package to provide a structure having a lower coefficient of thermal expansion. After fabricating a through hole or a plated through hole in an electronic package, the hole or via is filled with metal, and the surface of the electronic package is sealed.

Method of filling plated through holes

An apparatus for fabricating holes in a thin film has an elongated holding block for holding a column of electromagnetic driving coils. The holding block acts as a single unit, and is magnetically attached to a punch diebar. The magnetic attraction between the holding block and diebar provides easy assembly and disassembly of the parts.

Thin film hole making apparatus

The present invention provides a system for recording a heat exchange event within a drilled hole wall caused during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

Apparatus for measuring the temperature of a circuit board during a

The present invention provides a method of creating a circuit board having burr free castellated plated through holes. In particular, the leading edge of the plated through hole, that tends to produce burr formation using conventional profiling methods, is removed or pre-profiled. The pre-profiled plated through hole is then profiled at a distance slightly off-set from the pre-profiled edge to further prevent burr formation.

Method of making a circuit board having burr free castellated plated

A method and apparatus for optimizing the drilling position of a multi-layer printed circuit board prior to drilling. Each board is x-rayed to determine location coordinates information of the inner layers of multi layer circuit board panels. An optimization process determines optimal locations for drilling. The board is then drilled according to the optimized coordinates. By minimizing misregistration between the drilled holes and inner layers of the multi layer semiconductor circuit board, the present invention reduces a significant cause of scrap to the circuit board industry as well as removing a major impediment to further increasing circuit density and wireability.

Minimum error algorithm/program

The present invention provides a system for recording a heat exchange event within a drilled hole wall of a substrate during a drilling process. In particular, the invention includes a thermal sensitive film placed in contact with a substrate which is to be drilled, which is capable of recording a thermal signature of the heat transferred during the drilling process. The result is a ring shaped signature whose thickness provides a direct correlation to drilling temperature. With these results, the integrity of the substrate surrounding the drilled hole can be inspected.

Apparatus for measuring a temperature of a substrate during a drilling

One or more porous air film rolls are used, in a system to support a flexible web during movement of the web, and selectively provide either compliant or rigid clamping of the web while performing processing operations on the web at a work station. The present invention is particularly suitable for punching holes on-the-fly, in both 'X' and 'Y' directions, in a flexible polyamide film. Up to a four-fold increase in punch tool productivity is provided by the present invention.

System and method for transporting and clamping flexible film structures

Method for recording the heat generated in a hole wall of a substrate

An apparatus and method of using same for exposing successive sections of opposite sides of a web of material to actinic radiation in patterns on each section of the opposite sides of the web is provided. The apparatus includes a first station having mechanisms to locate and expose selected sections on the first side of the web to actinic radiation in a first patterns, and a second station spaced from the first station having mechanisms to locate and expose selected sections on the second side of said web to actinic radiation. The first and second stations include first and second pattern masters and first and second mountings for the masters, and first and second sources of actinic radiation to project the desired patterns of exposure from each of the masters to each of the sections on the first and second sides of the web in very close registration or alignment thereof. Each of the stations includes a web locating device to locate the web and the master with respect to each other at each station, and each of said stations includes a mechanism to selectively maintain the master and web in a located position contacting each other during exposure, and a web transfer mechanism to periodically transport the sections to and from the stations. The invention also includes a program which uses fiducial marks on the masters and alignment devices on the web to provide a best fit of the master with the web at each location.

Dual-sided expose mechanism for web product

Growing community of inventors

Apalachin, NY, United States of America

David Erle Houser