Measurement Specialties, Incorporated

Te Connectivity Solutions Gmbh

Tyco Electronics Amp Korea Co., Ltd.

David Eric Wagner

James Hoffman

Natasha V Kachenko

Gerald Lopopolo

Predrag Drljaca

Jean-Francois Le Néal

Martin Pfeiffer

Schahrazède Mouaziz

Vincent M Wong

John J Valentini

Weijun Xie

Kaspar L Jenni

James H Hoffman

Kim Young-Deok

Schahrazede Mouaziz

A strain gauge includes a resistor formed of a doped silicon material, a conductive shield, and an isolation element disposed between the resistor and the conductive shield. The isolation element electrically isolates the resistor from the conductive shield.

Strain gauge and strain measurement assembly

Pressure sensor assemblies comprise a sensor body having a sensing membrane and wherein a fluid is placed in communication with the membrane to determine a fluid pressure. A support is connected with the body and includes an opening for receiving the fluid from an external source, wherein the opening is in fluid-flow communication with the membrane. The pressure sensor comprises one or more elements disposed therein configured to mitigate transmission of a fluid pressure spike to the sensing membrane. The body or the support may have a pressure mitigating element, e.g., an internal channel, for receiving the fluid from the opening and transferring it to the membrane, wherein the channel may itself be configured to provide the desired protection against fluid pressure spikes, or may be connected with another internal element to provide such protection.

Pressure sensor assemblies with protective pressure feature of a pressure mitigation element

Pressure sensor assemblies comprise a sensor body having a membrane within the body for placement in communication with a fluid from an external source and determining a pressure of the fluid. A support is connected with the body and includes a channel extending therethrough for receiving the fluid, wherein the channel is in fluid-flow communication with the membrane. A substrate is connected with the support and comprises a channel extending therethrough for receiving the fluid from an external source. The support may be formed from a material having a coefficient of thermal expansion that is between a coefficient of thermal expansion of the support and a coefficient of thermal expansion of the external fluid source connected with the substrate. One of the substrate or the support comprises a fluid pressure mitigation feature for mitigating the transmission of a pressure spike in the fluid to protect the sensor membrane.

Pressure sensor assemblies with protective pressure feature

A sensor assembly comprising a housing defining a cavity, and a pressure sensor package arranged within the cavity. The pressure sensor package includes a substrate having an aperture defined therethrough, a semiconductor die including a sensing diaphragm attached to the substrate such that the diaphragm is exposed via the aperture, and at least one electrically conductive element in electrical communication with the semiconductor die arranged on the substrate. A sealing element, such as an elastomeric o-ring, provides a seal between the housing and the substrate. A connector is secured to the housing via a crimped connection for establishing electrical connections between the pressure sensor package and an external system.

Modular sensor package having adhesive-free seal to housing

A differential pressure sensor includes a first sensor housing member having a first fluid inlet port for receiving a first fluid at a first pressure and a second sensor housing member having a second fluid inlet port for receiving a second fluid at a second pressure. A pressure-sensing subassembly includes a semiconductor pressure-sensing die having a sensitive diaphragm for sensing pressure. The pressure-sensing subassembly is configured for insertion into the differential pressure sensor such that once inserted the first fluid inlet port is in fluid communication with a first surface of the sensitive diaphragm and the second fluid inlet port is in fluid communication with a second surface of the sensitive diaphragm.

Pressure sensor sub assembly and fabrication

A differential pressure sensor includes one or more semiconductor dies which are thinned at portions of the die to create a chamber defining a sensitive diaphragm, having piezoresistive elements defined at a surface of the diaphragm. A first diaphragm is in fluid communication with a first fluid on an upper surface of the first diaphragm and is in fluid communication with a second fluid on a lower surface of the first diaphragm. A second diaphragm is in fluid communication with ambient pressure at an upper and a lower surface of the second diaphragm. The piezoresistive elements corresponding to the second diaphragm are electrically connected to the piezoresistive elements of the first diaphragm so as to compensate the output of the second diaphragm with respect to the output of the first diaphragm.

Method and apparatus for correction of pressure sensors

A differential pressure sensor may provide a common mode corrected differential pressure reading. The differential pressure sensor may include two pressure sensing diaphragms. The pressure sensor may be configured so that the first diaphragm measures the differential pressure between two sections of a fluid. The pressure sensor may also be configured so that the second diaphragm measures the common mode error experienced by the die at the time the differential pressure is read by the first diaphragm. Electrical connectors may be configured so that the differential pressure outputs a common mode error corrected differential pressure reading based on the readings of the first and second diaphragm.

Differential pressure sensor incorporating common mode error compensation

A differential pressure sensor includes a pressure sensing die comprising a semiconductor die, having a thinned portion forming a diaphragm. The diaphragm includes piezo-resistive elements that exhibit varying resistance based on force exerted on the diaphragm. A first support structure is bonded to a first surface of the semiconductor die, having an aperture defined through the support structure such that a first surface of the diaphragm is exposed through the aperture. A second support structure is bonded to the opposite side of the semiconductor die having an aperture aligned with the opposing side of the diaphragm. Electrical components in electrical communication with the piezo-resistive elements are arranged outside the region defined by the bond between the first and second support structures and the semiconductor die. An oil-filled volume may be defined between the semiconductor die and a harsh medium which transmits a fluid pressure to the die without the harsh medium contacting the die.

Package for a differential pressure sensing die

A pressure sensor assembly for measuring the pressure of a first fluid. The assembly having a first housing including a pressure sensing device arranged therein. A diaphragm is arranged on a surface of the first housing and is configured to transmit a force exerted on a first side thereof to the pressure sensing device. A second housing is provided and attached to the first housing. The second housing may be arranged generally circumferentially around the diaphragm. A compressible element is provided and arranged within a compressible element space defined within the second housing. The compressible element is configured to transmit a force exerted thereon by the fluid to the first side of the diaphragm.

Freeze proof protection of pressure sensors

Differential pressure sensing die

Differential pressure sensor

An electronic pressure-sensing device is isolated from corrosive, conductive gasses and fluids by a corrosion resistant metal diaphragm welded to a pressure port. The pressure-sensing device is attached to a support structure with a hole that provides a path from the diaphragm area to the pressure-sensing device. A fill fluid is sealed behind the diaphragm and fills the hole through the support structure to the electronic pressure-sensing device. In this design, any hostile chemical applied is completely isolated from the electronic sensor and associated adhesive seals by the metal diaphragm.

Isolation technique for pressure sensing structure

A strain-sensing device comprises a metal, glass, ceramic, or plastic cell that has formed within it a diaphragm characterized by a thin layer of material bounded by a thick layer of material. A silicon strain gauge, either junction isolated or dielectric isolated, is attached directly to the diaphragm. The strain gauge has at least one sensing element that is aligned such that applied pressure to the diaphragm induces a strain in the sensing element. The silicon strain gauge has a triangular shape that is optimizes the performance and reliability of the sensor with the added benefit of making it more affordable as well.

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Los Gatos, CA, United States of America

David Eric Wagner