Amazon Technologies, Inc.

International Business Machines Corporation

Other

Hewlett-packard Development Company, L.P.

David Eric Peters

John Avery Howard

Ross Kenneth Thayer

Ramez Nachman

Shan Cheng

Mohammed Aftab Alam

James Robert Lim

Jason Conrad Chamberlain

Vikram Srinivas

Christopher Thomas Li

Shankar Ganapathysubramanian

Stewart Robin Shearer

Carl Philip Taussig

Kirk Barrows Price

John Espinoza Sanchez, Jr

Daniel Robert Stacer

Andrew Keith Hanlon

Edward Albert Liljegren

Hung-Bing Tan

Vigneswaran Rajagopalan

Felipe Misch

ChengChien Lu

Conan Zhang

Bobby Dean Landreth

Chengchien Lu

An apparatus comprises an electrochemical energy storage device, a non-conductive film at least partially covering the electrochemical energy storage device, and a nano-grain metallic film at least partially covering the non-conductive film. The electrochemical energy storage device may include a cathode electrode layer, an anode electrode layer, and a separator layer therebetween.

Battery package structure

An electronic device includes a display screen, one or more internal components, and a foam outer housing coupled to the display screen and enclosing the one or more internal components. The electronic device may also include a foam midframe enclosed by the foam outer housing. The foam outer housing may be resilient so as to provide impact absorption and water resistance, while the foam midframe may be rigid to provide stiffness to the electronic device. The electronic device may have a density less than 1 gram/centimetersuch that the electronic device is buoyant in liquid water.

Low density electronic device

A flexible housing for a flexible electronic device is coupled to a cover lens for enclosing components disposed between the flexible housing and the cover lens. The flexible housing includes a flexible polymer substrate. A first metal layer covering at least a portion of the flexible polymer substrate. A second metal layer is disposed on the first metal layer. A protective coating covers the second metal layer.

Flexible protective housing for electronic devices

Described are techniques for controlling the transfer of heat on various portions of a device or other structure. A structure may include a substrate having a first thermal conductivity. A material having a different thermal conductivity is distributed on the substrate. The position, quantity, and thickness of the material affects the manner in which heat is transferred away from at least one hot spot on the substrate.

Structure for transferring heat in devices

This disclosure describes composite structures and method of making the structures. The structures according to this disclosure may be used in handheld electronics. In example embodiments, holes are formed through a planar polymeric core. A metallic coating is disposed on the core to coat external surfaces of the core as well as internal surfaces of the holes. The metallic coating may entirely occlude the holes. The resulting structure may provide improved strength and rigidity and resist delamination of the metallic coating.

Composite structures and methods of making

Techniques are described to determine a thickness of individual layers of a plurality of metal layers that include a first metal layer disposed on a polymer material and a second metal layer disposed on the first layer, such that the first layer is between the polymer material and the second layer. A measurement device may determine a resistance of the plurality of metal layers and calculate (e.g., estimate) a thickness of the individual layers based on the resistance of the individual layers and based on a resistivity of individual metals used in the plurality of metal layers. The measurement device may determine whether the individual thicknesses are within predetermined thickness ranges to determine whether to pass a quality control test.

Determining a thickness of individual layers of a plurality of metal layers

The disclosure describes methods of fabricating a single-piece housing for an electronic device using an injection molding process. Illustrative fabrication processes describe variations of positioning internal components of an electronic device into a mold enclosure and injecting a foam material to produce a single-piece housing that surrounds the internal components. The single-piece housing may be fabricated to provide the electronic device with at least some buoyancy, as well a means to expel thermal radiation emanating from internal components. Further, the fabricated single-piece housing provides enough structural rigidity to protect internal components of the electronic device from damage, while retaining some malleability to flex without damage when an external pressure is applied.

Over-mold foam enclosure

Describe herein are electronic devices that includes a display stack having a composite cover component atop a display component. In some instances, the composite cover component includes a top layer and a bottom layer formed from an inorganic material and at least one inner layer formed from an organic material. In other instances, the composite cover component includes a top layer and a bottom layer formed from an organic material and at least one inner layer formed from an inorganic material.

Composite cover assembly for electronic devices

A housing of a computing device, such as a computer, laptop computer, cellular phone, personal digital assistant (PDA), tablet computer, electronic reader or e-reader, or other mobile device constructed using a combination of a metal material and a lightweight core material. The housing includes a front housing component including a display and a rear housing coupled to the front housing component with an internal side of the rear housing facing the front housing. The rear housing component includes a core material and a structural material coupled to the core material at strategic locations. For example, the structural material may be located around a periphery of the rear housing, around connection ports of the electronic device, and diagonally across the external side to provide strength and stiffness to the rear housing.

Variable plated device enclosure

An electronic device housing is described that includes a substantially flat support plate comprising a composite material and an edge frame comprising a foam material. The edge frame is coupled to the support plate at a perimeter of the support plate and defines a cavity. One or more electronic components may be disposed in the cavity.

Electronic device housing

A foam layer may be reinforced by applying a primer layer prior to application of a metal or other absorbent layer. The primer layer seals the foam layer so that the foam layer does not absorb portions of the metal layer in a manner that may significantly increase the weight of the foam layer. Thus the foam layer may be reinforced by metal layers while maintaining its low weight properties. The reinforced foam layer may be used to create a component for an electronic device.

Reinforced structural composite

Described are features to control distribution of thermal energy by structures such as portions of a case of a device. Various patterns of thermally conductive or insulating substances alter the thermal conductivity of a structure and provide selective directional distribution of thermal energy away from a hot spot caused by operation of a device component. The features result in a predetermined distribution of thermal energy across one or more structures, and may increase thermal uniformity.

Altering thermal conductivity in devices

Solid structures for thermal management are provided. In one aspect, the solid structures can comprise a metal-ceramic composite member assembled to be in thermal contact with a heat source. The metal-ceramic composite member can be mechanically coupled to an assembly (e.g., an electronic assembly) containing the heat source, and can provide mechanical stability to such assembly. In another aspect, the solid structures can comprise an oxide member that covers a surface of the metal-ceramic composite member, forming a metal-ceramic-oxide interface at the surface. The thickness of the oxide member combined with the magnitude of its thermal conductivity relative to the thermal conductivity of the metal-ceramic composite member can permit heat transport substantially along a direction substantially parallel to the metal-ceramic-oxide interface, and can reduce heat transfer through such interface.

Solid structures for thermal management

A structure of a device, such as a surface coating, is composed of one or more materials that are arranged to change one or more characteristics in response to a stimulus, such as an electrical signal, a magnetic field, application of thermal energy, and so forth. The changed characteristics may include a tactile characteristic, a visual characteristic, or other type of characteristic that is perceivable by a user of the device. A state for the adjustable structure may be determined based on user preference data that is stored on the device or input by a user through a user interface. The state for the adjustable structure may also be automatically determined based on device motion, orientation, environment factors, and so forth.

Growing community of inventors

San Jose, CA, United States of America

David Eric Peters