Applied Materials, Inc.

Orbotech Lt Solar, Llc.

Quantumscape Battery, Inc.

Other

Applied Komatsu Technology, Inc.

Quantumscape Corporation

Oriol Inc.

Inopla Inc.

Komico Technology, Inc.

David Eric Berkstresser

Wendell T Blonigan

Richard Ernest Demaray

John M White

Manuel J Herrera

Craig Lyle Stevens

Shinichi Kurita

Norman L Turner

Weston Arthur Hermann

Masato M Toshima

Kam S Law

Billy C Leung

Steve Kleinke

Robin L Tiner

Phillip John Weicker

Timothy P Holme

In-kwon Jeong

Ernst Keller

Yi Zhou

Carl T Petersen, Iii

Martin M Winterkorn

Yamini Mohan

John Olenick

Lucas Broganer

Matthew Sheffield

Stuart D Barter

Tim Holme

Akihiro Hosokawa

Bradley Owen Stimson

In Kwon Jeong

Gregory Lewis

Arnold Allenic

Yoshiaki Tanase

Jae-Chull Lee

Jino Park

Jerry J Berkstresser

Wendell Thomas Blonigan

Provided herein are rapid, high quality film sintering processes that include high-throughput continuous sintering of lithium-lanthanum zirconium oxide (lithium-stuffed garnet). The instant disclosure sets forth equipment and processes for making high quality, rapidly-processed ceramic electrolyte films. These processes include high-throughput continuous sintering of lithium-lanthanum zirconium oxide for use as electrolyte films. In certain processes, the film is not in contact with any surface as it sinters (i.e., during the sintering phase).

Rapid ceramic processing techniques and equipment

Provided are battery packs and interface modules for electrically interconnecting electrochemical cells in the packs and for providing heat distribution with the packs. An interface module interfaces one side of all electrochemical cells in a battery pack. The interface module may have a substantially planar shape such that the space occupied by the module in the battery pack is minimal. Most, if not all, conductive components of the interface module may be formed from the same sheet of metal. In some embodiments, the interface module includes multiple bus bars such that each bus bar interconnects two or more terminals of different electrochemical cells in the battery pack. Each bus bar may have a separate voltage sense lead extending from the bus bar to a connecting portion. The bus bars may be flexibly supported within the module. The interface module may also include multiple thermistors disposed on different bus bars.

Thermal and electrical management of battery packs

In an example, the present invention provides a method for forming a film of material for a solid state battery or other energy storage device. The method includes providing a first precursor species, and providing a second precursor species. The method also includes transferring the first precursor species through a first nozzle and outputting the first precursor species in a first molecular form and transferring the second precursor species through a second nozzle and outputting the second precursor species in a second molecular form. The method includes causing formation of first plurality of particles, ranging from about first diameter to about a second diameter, by intermixing the first precursor species with the second precursor species. The method also includes cooling the first plurality of particles at a rate of greater than 100&#xb0; C./s to a specified temperature.

Flash evaporation of solid state battery component

An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.

Methods and apparatus for providing a floating seal for chamber doors

An apparatus and method for recovery and cleaning of broken substrates, especially beneficial for fabrication systems using silicon wafer carried on trays. Removal of broken wafers and particles from within the fabrication system is enabled without requiring disassembly of the system and without requiring manual labor. A placing mechanism moves a suction head to location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the wafer to smaller pieces for easy removal.

Broken wafer recovery system

A method for auto-sequencing of plasma processing system for concurrent processing of several substrates. The method autonomously sequence processing and move substrates in different directions as necessary. The method moves two substrate trays together into the processing chamber for substrate exchange, and remove the trays from the chamber one at a time. When needed, the method moves one tray into the processing chamber for removal of the susceptor without exposing the chamber to atmospheric environment.

Auto-sequencing multi-directional inline processing method

An apparatus and method for concurrent processing of several substrates. The system employs a novel architecture which, while being linear, may autonomously sequence processing and move substrates in different directions as necessary. The system moves several substrates concurrently; however, unlike the prior art it does not utilize trays.

Auto-sequencing inline processing apparatus

A method is provided that includes isolating a sealing surface from a chamber wall of a chamber and sealing the chamber between the sealing surface and the chamber wall. An apparatus is provided that includes a chamber wall section prone to deflection, a stationary section providing a sealing surface, and a flexible bellows attached to the chamber wall section and the stationary section. A system is also provided that includes a chamber including a chamber wall having an opening, a door disposed to seal the opening, a sealing surface adjacent the opening and isolated from the chamber wall, and a seal between the sealing surface and the chamber wall. Numerous other aspects are provided.

Methods and apparatus for providing a floating seal having an isolated sealing surface for chamber doors

An apparatus and method for recovery and cleaning of broken substrates, for fabrication systems using silicon wafers. A placing mechanism moves a suction head to a location of the broken substrate and a suction pump coupled to a flexible hose is used to remove the broken pieces. A hood is positioned at the inlet of the suction head, and setback extensions are provided at the bottom of the hood to allow air flow into the inlet and prevent thermal conductance from the tray to the hood. Pins are extendable about the inlet of the suction head to enable breakage of the substrate to smaller pieces for removal.

Auto-sequencing multi-directional inline processing apparatus

A polishing apparatus for polishing semiconductor wafers comprises a main polishing structure, which includes a plurality of polishing tables, a plurality of polishing heads and a plurality of load-and-unload stations, and an add-on polishing structure, which includes an additional polishing table and an additional polishing head. The add-on polishing structure can be attached to the main polishing structure to form a larger polishing structure with the additional polishing table and the additional polishing head.

Configurable polishing apparatus

Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a convex sealing face and a backside. In another embodiment, a chamber having an apparatus for sealing a substrate transfer passage is provided that includes a chamber body having an interior volume, at least one substrate access defined through the chamber body configured to allow passage of a large area substrate therethrough, and a door member having a convex sealing face moveable between a first position that covers the substrate transfer port and a second position clear of the substrate transfer port. In yet another embodiment, the chamber body may be a load lock chamber.

Curved slit valve door

Embodiments of an apparatus for sealing a substrate transfer passage in a chamber are provided. In one embodiment, an apparatus for sealing a substrate transfer passage in a chamber includes an elongated door member having a concave sealing face coupled to an actuator by a flexible coupling. The flexible coupling configured to allow movement of the door member relative to the lever arm in at least two planes.

Curved slit valve door with flexible coupling

Growing community of inventors

Los Gatos, CA, United States of America

David Eric Berkstresser