Xilnix, Inc.

David E Schweigler

Inderjit Singh

Raghunandan Chaware

Eric Thorne

Glenn O'Rourke

Ganesh Hariharan

A testable circuit arrangement includes an integrated circuit (IC) package. The IC package includes a package substrate, an interposer mounted directly on the package substrate with level 1 interconnects, and at least one IC die mounted directly on the interposer with level 0 interconnects. The package substrate of the IC package is mounted directly on a connector board with a soldered ball grid array of level 2 interconnects. The level 0, level 1, and level 2 interconnects include respective power, configuration, and test interconnects. Power, configuration, and test terminals of the connector board are coupled to the power, configuration, and test interconnects of the level 2 interconnects.

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Copperopolis, CA, United States of America

David E Schweigler