Lam Research Corporation

Other

David E Jacob

William S Kennedy

Harlan I Halsey

Dean Jay Larson

Farro F Kaveh

Martin Robert Maraschin

A showerhead electrode assembly of a plasma processing apparatus includes a thermal control plate attached to a showerhead electrode, and a top plate attached to the thermal control plate. At least one thermal bridge is provided between opposed surfaces of the thermal control plate and the top plate to allow electrical and thermal conduction between the thermal control plate and top plate. A lubricating material between the thermal bridge and the top plate minimizes galling of opposed metal surfaces due to differential thermal expansion between the top plate and thermal control plate. A heater supported by the thermal control plate cooperates with the temperature controlled top plate to maintain the showerhead electrode at a desired temperature.

Showerhead electrode assembly for plasma processing apparatuses

A method of making an electrode assembly for a plasma processing apparatus includes securing a backing member to an electrode wherein first fastener members mounted in apertures in the backing member cooperate with second fastener members to hold the electrode assembly to a support member, such as a temperature-controlled top plate in a plasma processing chamber.

Method of making an electrode assembly for plasma processing apparatus

An electrode assembly for a plasma processing apparatus includes a backing member secured to an electrode. First fastener members mounted in apertures in the backing member cooperate with second fastener members to hold the electrode assembly to a support member, such as a temperature-controlled top plate in a plasma processing chamber.

Electrode assembly for plasma processing apparatus

A chamber for transitioning a semiconductor substrate between modules operating at different pressures is provided. The chamber includes a base defining an outlet. The outlet permits removal of an atmosphere within the chamber to create a vacuum. A substrate support for supporting a semiconductor substrate within the chamber is included. A chamber top having an inlet is included. The inlet is configured to allow for the introduction of a gas into the chamber to displace moisture in a region defined above the substrate support. Sidewalls extending from the base to the chamber top are included. The sidewalls include access ports for entry and exit of a semiconductor substrate from the chamber. A method for conditioning an environment above a region of a semiconductor substrate within a pressure varying interface is also provided.

Methods to minimize moisture condensation over a substrate in a rapid cycle chamber

A method for creating a reduced particle environment in a localized area of a mechanically active transport interface is provided. The augmentation of the air flow results in a sweeping air flow to remove particles in and around the desired area. The augmented air, flow will eliminate static or turbulent air flow regions and assist in removing potential particles from the vicinity of the substrate. This will prevent particles from being deposited on substrates thus fostering higher yields and improved quality.

Apparatus and method for creating an ultra-clean mini-environment through localized air flow augmentation

An atmospheric transport module is provided. The module includes an enclosed housing having a top region, a central region, a bottom region, and a load cell region. A blower is located in the top region of the enclosed housing and is configured to generate a flow of air downward into the central region. A shelf in the load cell region defines a separation between the central region and the bottom region of the enclosed housing. The shelf is at least partially spaced apart from a wall of the load cell region to thereby define a slot behind the shelf. A perforated sheet is configured to extend horizontally from the shelf and further define the separation between the central region and the bottom region. In this example, air flow generated by the blower is restricted from freely flowing through the perforated sheet and is partially caused to be redirected toward the shelf of the load cell, through the slot and into the bottom region of the enclosure housing. A cassette having one or more wafers is configured to sit on the shelf in the load cell and thus be subjected to the redirected air flow. This redirected air flow will thus gently flow over the surfaces of the wafers and assist in removing post-process gases and particles from over the wafer surfaces while the wafers temporarily sit in the atmospheric transport module.

Wafer atmospheric transport module having a controlled mini-environment

The presence and absence of a semiconductor wafer on a wafer holder in a vacuum chamber having an optically transparent window is detected by an optical system including a source of optical energy positioned outside the chamber and a receiver for the optical energy positioned outside the chamber. A light path extends from the source through the window and an opening in the wafer holder when no wafer is on the wafer holder. The optical path is bent downstream of the wafer holder, thence continues back through another opening in the wafer holder, and through the window to the receiver. The optical receiver is positioned and arranged so optical energy reflected from a wafer (even a wafer having dispersive mirror properties) in situ on the wafer holder cannot be reflected or otherwise incident on the optical receiver. The optical receiver thus has optical energy from the source incident on it when no wafer is present on the wafer holder and no optical energy from the source is incident on the receiver when a wafer is on the wafer holder.

Apparatus method for determining the presence or absence of a wafer on a

A building construction system is disclosed in which uniquely configured prefabricated concrete panels of great structural strength and high insulating value are employed. Each building panel, whether horizontal or vertical, is reinforced by transverse structural ties distributed along the panel length. Each structural tie includes a central portion of a reinforcing bar which has respective ends extending into concrete outer panel layers. Voids between the concrete outer layers may be filled with insulation such as polystyrene. A uniquely configured parapet is also disclosed. The parapet, which may extend to any length including the entire circumference of a building, comprises a channel which is generally parallel to the building edge and which is adapted to hold living plants including bushes, flowers and the like as well as small trees in enlarged channel regions. Thus, the utility of a building roof as a decorative and private living space is enhanced.

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Fremont, CA, United States of America

David E Jacob