International Business Machines Corporation

David E Engle

David W Dranchak

Thomas G Macek

Richard Ronald Hall

Alan D Knight

John J Squires

Fletcher W Chapin

Kishor V Desai

Wai Mon Ma

William S Ebert

James R Bentlage

David E Hessian

Geoffrey R Mariner

John H Williams

Robert E Darrow

A test apparatus and method for testing circuitized substrates such as printed circuit boards or ceramic substrates having one or more chips thereon. The apparatus includes one substrate (e.g., printed circuit board) located on a base and adapted for having another circuitized substrate (e.g., flexible circuit) positioned thereon and electrically coupled to conductive elements (e.g., copper pads) thereof. Elastomeric members may be used to force the flexible circuit against the conductors of the substrate being tested, this substrate positioned either within or upon a cover which is located over the flexible circuit and which assists in compressing the flexible circuit against the printed circuit board's conductive elements to assure positive connection therewith. The cover may also include elastomeric members to facilitate such connection and a pivotal arm for being actuated to engage the substrate being tested. Positioning as well as relative quick separation (removal) of the substrate is attainable upon completion of the testing.

Test apparatus for circuitized substrate

A structure and method for mounting a flexible electrical circuit to rigid substrate to effect electrical connection between contacts on one side of the flexible electrical circuit with electrical pads on one side of the substrate is provided. The connection allows for strain relief due to mechanical stress, as well as compensating for thermally induced stress. The structure includes a clamping member disposed to clamp and position the flexible circuit with its one side in face to face relationship with the surface of the substrate. A supporting structure is carried by the substrate and has a mounting member mounting the clamping member to maintain the flexible circuit and the substrate in face to face contacting relationship. The mounting structure also includes a spring mechanism yieldingly responsive to thermal expansion stress which mechanism urges the flexible circuit into contact with the substrate. The invention also includes an assembly tool for aiding in the formation of bonds between the pads and the contacts.

Temperature compensating strain relief connection for flexible

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the connector's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g., silicone) which further include a quantity of conductive (e.g., metallic) particles therein. To assure a wiping form of engagement with the respective conductive pads, each of the terminal ends of each contact member preferably includes a plurality of dendritic, interdigitated members thereon.

High density connector

An electronic package including a first circuitized substrate (e.g., printed circuit board) and a flexible circuitized substrate wherein the flexible substrate is precisely aligned in removable manner relative to the first substrate. This is accomplished utilizing a retention member and associated frame member, the flexible circuitized substrate being precisely aligned and secured to the frame member. Elastomeric pressure exertion members are utilized to exert pressure against each of a plurality of individual circuitized sections of the flexible circuit member to thus effect engagement between the flexible substrate's contacts and respective conductors which constitute part of the circuit on the first substrate. Moveable clamp members may also be used to engage extending posts of the retention member, said clamp members also possibly acting against a stiffener member located on the first substrate's opposite surface from the flexible substrate.

Electronic package for high density applications

An electrical connector for interconnecting a pair of circuit members (e.g., circuit module and printed circuit board) which assures highly reliable yet separable connections for these members. The connector includes an electrically insulative (e.g., plastic) frame which defines an internal opening therein. Bridging this opening are a plurality of individual, resilient contact members which are maintained in a suspended and spaced orientation within the opening by a plurality of pairs of elongated insulative members (e.g., polymer rods). Each of the contacts is thus readily removable from the conenctor's frame to thus facilitate repair and/or replacement. As described, the connector is capable of providing wiping connections, thus assuring removal of debris or other contaminants from the respective conductive pads for each circuit member. In another embodiment, the connector includes a common carrier (e.g., plastic) having therein a plurality of cylindrical shaped resilient contact members (e.g., silicone) which further include a quantity of conductive (e.g., metallic) particles therein. To assure a wiping form of engagement with the respective conductive pads, each of the terminal ends of each contact member preferably includes a plurality of dendritic, interdigitated members thereon.

An assembly for interconnecting two relatively rigid circuit cards using a flexible circuit for forming this connection is provided. The assembly includes a housing which has a first pressure exerting member which has the flexible circuit reeved therearound. Second and third pressure exerting members are provided in spaced juxtaposed relationship against which the opposite legs of the flexible circuit are maintained to define therebetween a slot for the reception of a circuit card. The assembly is inserted into a card substrate with the first pressure exerting means causing the flexible circuit to be biased into contact with the contacts on a substrate. A second circuit card is inserted into the slot between the legs of the flexible circuit, and the second and third pressure exerting members urge each of the legs as the flexible circuit into contact with the second circuit board.

Electrical connector utilizing flexible electrical circuitry

An electrical connector assembly including a housing, a flexible circuit located within the housing and including first and second terminals thereon, a carriage movably positioned within the housing and designed for having a circuit board inserted therein, actuation means connected to the carriage to cause it to move and occupy first and second positions within the housing, and biasing means in the form of a pair of leaf springs which continuously exert biasing force against the carriage during its positioning within the invention's housing. As defined herein, contact is possible between a plurality of individual contact elements which form part of the circuit board and respective terminals located at one end portion of the flexible circuit. Second terminals located at the other end of the flexible circuit are designed for mating with and contacting respective conductors located on the second circuit device. Positive interconnection is thus possible between high density arrays of contact members in a compact structure.

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Vestal, NY, United States of America

David E Engle