Intel Corporation

David E Duarte

George L Geannopoulos

Gregory F Taylor

Jonathan P Douglas

J Keith Hodgson

Avner Kornfeld

Takao Oshita

James S Ayers

Mohamed A Abdelmoneum

Yongping Fan

You Li

Keng L Wong

Atul Maheshwari

Usman Mughal

Mathew B Nazareth

Mingwei Huang

Kedar Mangrulkar

Venkatesh Prasanna

Shuching Hsu

Paola Zepeda

A low power hybrid reverse (LPHR) bandgap reference (BGR) and digital temperature sensor (DTS) or a digital thermometer, which utilizes subthreshold metal oxide semiconductor (MOS) transistors.

Low power hybrid reverse bandgap reference and digital temperature sensor

A low power hybrid reverse (LPHR) bandgap reference (BGR) and digital temperature sensor (DTS) or a digital thermometer, which utilizes subthreshold metal oxide semiconductor (MOS) transistor and the PNP parasitic Bi-polar Junction Transistor (BJT) device to form a reverse BGR that serves as the base for configurable BGR or DTS operating modes. The LPHR architecture uses low-cost MOS transistors and the standard parasitic PNP device. Based on a reverse bandgap voltage, the LPHR can work as a configurable BGR. By comparing the configurable BGR with the scaled base-emitter voltage, the circuit can also perform as a DTS with a linear transfer function with single-temperature trim for high accuracy.

Embodiments of the present disclosure provide self-calibrated thermal sensors of an integrated circuit (IC) die and associated techniques and configurations. In one embodiment, a self-calibrating thermal sensing device includes a resonator configured to oscillate at a frequency corresponding with a temperature of circuitry of an integrated circuit (IC) die, wherein the resonator is thermally coupled with the circuitry and configured to operate in a first mode and a second mode and logic operatively coupled with the resonator, and configured to calculate a first temperature corresponding with a first frequency of the resonator in the first mode using a first equation, calculate a second temperature corresponding with a second frequency of the resonator in the second mode using a second equation, and add an offset to the first equation and the second equation based on a result of a comparison of the first temperature and the second temperature. Other embodiments may be described and/or claimed.

Self-calibrated thermal sensors of an integrated circuit die

Described is an analog to digital converter (ADC) which comprises: a sigma-delta modulator to receive an analog signal, the sigma-delta modulator operable to perform chopping to cancel common-mode noise; and one or more counters coupled to the sigma-delta modulator to generate a digital code representative of the analog signal.

Low power analog to digital converter

In one embodiment, an analog-to-digital conversion in an integrated circuit is evaluated by an on-die testing circuit. For example, the on-die test circuitcan characterize one or both of the linearity and monotonicity of the digital-to-analog conversion. The value of a conversion output for a digital input code may be compared to the value of a prior conversion output of a prior step to provide digital difference values for each step of a sweep of digital input codes. Digital difference values may be compared to one or more predetermined limits to provide one or more pass/fail tests on-board the die. Other embodiments are described and claimed.

On-die digital-to-analog conversion testing

In one embodiment, an apparatus is constituted with a temperature sensing circuit adapted to be coupled to a current sources circuit, and configured to measure a circuit temperature and to generate a temperature-indicating signal in response to the circuit temperature and an adjustable current output by the current sources circuit; a reference voltage circuit to be coupled the current sources circuit and configured to provide a reference signal in response to a reference current output by the current sources circuit; and a trip generator circuit coupled to the temperature sensing circuit and the reference voltage circuit and configured to generate a trip point signal if a difference between the reference and the temperature-indicating signals indicates that a threshold circuit temperature has been reached or exceeded.

Thermal sensor and method

An embodiment of the present invention is a technique for thermal sensing. A sensing structure generates a response according to a local temperature at a first location on a die. A sensor core coupled to the sensing structure via routing lines to provide a measurement of the local temperature from the response. The sensor core is located at a second location remote to the first location and is powered by an analog supply voltage source located in a vicinity of the second location.

Accurate on-die temperature measurement using remote sensing

A voltage-controlled oscillator (VCO) of ring-connected stages, where each stage in the VCO has a first set of differential inverters biased by variable bias voltages, and a second set of differential inverters biased by fixed bias voltages. The differential inverters in each stage are connected in parallel with each other. Each set of differential inverters in a stage may contain only one differential inverter. The variable bias voltages are provided by charge pumps and associated circuits as used in well-known self-biasing schemes for phase locked loops. The fixed bias voltages are provided by a biasing circuit, matched to the circuits associated with the charge pumps, but where a fixed control voltage is applied to provide the fixed bias voltages.

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Portland, OR, United States of America

David E Duarte