Agilent Technologies, Inc.

Solexel, Inc.

Avago Technologies Ecbu IP (singapore) Pte. Ltd.

Avago Technologies Wireless IP (singapore) Pte. Ltd.

Oned Material, Inc.

David Dutton

Mehrdad M Moslehi

Pawan Kapur

Suketu Arun Parikh

Somnath S Nag

Karl-Josef Kramer

Nevran Ozguven

David P Stumbo

Francisco A Leon

Sean M Seutter

Arthur Schleifer

Anthony Calcaterra

Francesco Lemmi

Frank Sigming Geefay

Jeffrey L Miller

Nicolas J Moll

Karen L Seaward

Jay Ashjaee

Randall Scott Urdahl

John Stephen Kofol

Qing Bai

Joe Kramer

Burcu Ucok

Asli Buccu Ucok

Karen L Seward

Homi Fatemi

Processing equipment for the metallization of a plurality of semiconductor workpieces. A controlled atmospheric non-oxidizing gas region comprises at least two enclosed deposition zones, the controlled atmospheric non-oxidizing gas region is isolated from external oxidizing ambient. A temperature controller adjusts the temperature of the semiconductor workpiece in each of the at least two enclosed deposition zones. Each of the enclosed deposition zones comprising at least one spray gun for the metallization of the semiconductor workpiece. A transport system moves the semiconductor workpiece through the controlled atmospheric non-oxidizing gas region. A batch carrier plate carries the semiconductor workpiece through the controlled atmospheric non-oxidizing gas region. The controlled atmospheric non-oxidizing gas region further comprises a gas-based pre-cleaning zone.

High productivity spray processing for the metallization of semiconductor  workpieces

A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The reusable template has a three-dimensional (3-D) surface topography comprising a plurality of raised areas comprising a rounded top and separated by a plurality of depressed areas.

Structure and method for creating a reusable template for detachable thin film substrates

The present invention relates to methods of forming substrate elements, including semiconductor elements such as nanowires, transistors and other structures, as well as the elements formed by such methods.

Methods for formation of substrate elements

A structure and method operable to create a reusable template for detachable thin semiconductor substrates is provided. The template has a shape such that the 3-D shape is substantially retained after each substrate release. Prior art reusable templates may have a tendency to change shape after each subsequent reuse; the present disclosure aims to address this and other deficiencies from the prior art, therefore increasing the reuse life of the template.

Method of creating reusable template for detachable thin film substrate

A hand-held device includes a display, a position sensor, a communication port operable to receive screen image data, and a processor. The processor is operable to determine a new cursor position in response to a change of position detected by the position sensor. The processor is additionally operable either to display on the display a window of an image positionally referenced to the new cursor position in response to screen image data when the hand-held device is operated in a remote mode. Alternatively, the processor is operable to display on the display a local image in response to local image data and a cursor icon overlaid on the local image when the hand-held device is operated in a local mode. The image displayed represents a fractional portion of the local image data, and the fractional portion is selected in response to the new cursor position.

Computer input device and method of using the device

Aspects of the invention include sample ionizing devices and methods of use thereof. Embodiments of the sample ionizing devices include a microplasma generation source with a plasma generation region, a sample input port for delivering a sample to the plasma generation region, and a gas flow element configured to flow gas through the microplasma generation source independently of the sample input port. The devices and methods of the invention find use in a variety of different applications, including analyte detection applications.

Microplasma-based sample ionizing device and methods of use thereof

An attachment system. The attachment system includes a first structure and a second structure. The first structure has a surface and a recess in the surface. The second structure is molded into the recess and extends above the surface. The second structure adheres to the first structure at a boundary of the recess.

Attachment system incorporating a recess in a structure

A contamination detector in accordance with one embodiment of the invention includes a plasma generation system operable to direct an atmospheric plasma discharge towards a surface. The contamination detector further includes a light capture system to capture light generated by interaction of the atmospheric plasma discharge with the surface. The light capture system guides the captured light to an optical detection system configured to detect a contaminant.

Surface contamination detection

A method for planarizing a substrate surface having a non-planar surface topography comprises forming a material layer over the substrate, the material layer having a surface topography, determining the surface topography of the material layer, and forming a mask using information relating to the surface topography of the material layer. The mask defines portions of averaging regions of the material layer for selective removal to equalize the averaging regions in average height, the averaging regions having a maximum dimension. The material layer is etched using the mask, and a planarizing layer is formed over the substrate surface. The planarizing layer provides a low-pass lateral filtering effect characterized by a length greater than the maximum dimension of the averaging region. The mask is created by determining the localized height of the material layer across a surface and using the mask to etch away corresponding portions of the material layer so that the average surface of the material layer approximates a planar surface. The surface of the second material layer is substantially planar. The system and method for planarizing a material layer provides for forming a substantially planar layer of material over a non-planar topography.

System and method for planarizing a substrate surface having a non-planar surface topography

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San Jose, CA, United States of America

David Dutton