Fujitsu Corporation

Fijitsu Limited

David Dung Ngo

Solomon I Beilin

William T Chou

Michael G Lee

Michael G Peters

James J Roman

Yasuhito Takahashi

Som S Swamy

Several inventive features for increasing the yield of substrate capacitors are disclosed. The inventive features relating to selective placement of insulating layers and patches around selected areas of the capacitor's main dielectric layer. These insulating layers and defects prevent certain manufacturing processing steps from creating pin-hole defects in the main dielectric layer. The inventive features are suitable for any type of material for the main dielectric layer, and are particularly suited to anodized dielectric layers.

Power conducting substrates with high-yield integrated substrate capacitor

Methods of etching polyamic acid layers and the like are disclosed. In exemplary embodiments of the present invention, the polymeric acid layer to be etched is alternatively exposed to etchant solutions (etchants) and rinse solutions, where the etchant solutions are of relatively moderate alkalinity and the rinse solutions have a lower pH than the etchant solutions. The present invention enables polymeric acid layers to be developed with standard basic etchants at relatively moderate concentrations and at room temperature with little, if any, corrosion to any underlying metal layers. The present invention enables the more reliable and cleaner spin-spray processing method to be employed, thereby significantly increasing yields and reducing overall processing costs. The present invention also enables the etching of thick layers of polymeric acid without the need for special treatments, such as exposure to highly concentrated etchant solutions or high temperature processing conditions.

Method of patterning polyamic acid layers

Normally, a positive photoresist is developed with an alkaline aqueous solution to form patterns, and is subsequently stripped with an organic solvent after the photoresist has served its function. Such strippers are relatively toxic and damaging to the environment, and cannot be handled by standard (community) waste-water treatment facilities. These strippers cannot be easily neutralized, and must be disposed of in a highly specialized and relatively expensive manner. The present invention provides a method of treating positive and negative photoresists during their usage as photo masks such that the photoresists may be removed by less toxic chemicals which can be readily neutralized and handled by conventional waste water treatment facilities.

Environmentally friendly removal of photoresists used in wet etchable

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San Jose, CA, United States of America

David Dung Ngo