Applied Materials, Inc.

Motorala, Inc.

David Datong Huo

Hung Chih Chen

Dominic J Benvegnu

Jeonghoon Oh

Thomas B Brezoczky

Timothy Joseph Franklin

Andreas Norbert Wiswesser

Douglas R McAllister

Kerry F Hughes

Jay Rohde

Ramiel Oshana

Anantha K Subramani

Hui W Chen

David T Or

Donald M Mintz

Bret W Adams

Jim Kellogg Atkinson

Lolita L Sharp

John Jarvis

J Darrel Stickler

In one aspect, a scrubber brush assembly is provided. The scrubber brush assembly includes a scrubber brush having a body of open-cell foam including an interior surface, a sleeve received in contact with the scrubber brush, the sleeve including peripherally-spaced, longitudinal walls and reinforcing segments interconnecting adjacent ones of the longitudinal walls and forming elongated pockets along the length, the sleeve having raised ribs extending along the length, and a mandrel having recesses formed on an outer surface, the mandrel being coupled to the sleeve by receiving the raised ribs within the recesses. Scrubber brush subassemblies, high stiffness mandrels, and methods of assembly are provided, as are numerous other aspects.

High stiffness, anti-slip scrubber brush assembly, high-stiffness mandrel, subassemblies, and assembly methods

A polishing layer of a polishing has a window member with a top surface positioned a predetermined distance below the polishing surface. A transparent layer can be positioned below the polishing layer and supporting the window member.

Method of making and apparatus having polishing pad with window

A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have thick and thin subportions to increase the flexibility of the lower ring.

Composite retaining ring

Polishing pad with window

A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increase the flexibility of the lower ring.

A device for achieving vacuum conditions more quickly in a semiconductor processing system having a vacuum pump, a gate valve and a chamber includes a rigid body containing heating elements that contact the surface of the gate valve. The device may include a U-shaped retainer clip for holding the device to the gate valve. A method for heating a gate valve to drive off contaminants involves heating the lower portion of the gate valve to drive contaminants towards the vacuum pump.

Method and apparatus for baking out a gate valve in a semiconductor processing system

A semiconductor fabrication equipment component which is exposed to a film layer fabrication environment exhibits a surface which is embossed with a pattern to provide an enhanced surface area for particle retention. The component is fabricatable using numerous embossing techniques, including knurling. The embossed surface provides the enhanced surface area without imposing a particle load on the treated part.

Embossed semiconductor fabrication parts

Apparatus, positioned at an inlet port to a pump, for shielding the pump from a process chamber of a semiconductor wafer processing system, where the apparatus has a controllably variable effective throughput area, and method for electrically controlling the size of the effective throughput area. Specifically, the apparatus is a controllable restrictor shield supported by an actuator, having a first effective throughput area and a second effective throughput area, where the first effective throughput area is typically less than the second effective throughput area. The size of the effective throughput area is directly responsive to an electric signal that controls the actuator.

Method and apparatus for positioning a restrictor shield of a pump in

Method and apparatus for baking out a gate valve in a semiconductor

A vacuum processing system has a process chamber with a rotating member, such as a magnetron in a physical vapor deposition (PVD) chamber, disposed near a surface, such as a target in a PVD chamber. The rotating member and the surface are cooled by a cooling fluid. The rotational motion of the rotating member induces the cooling fluid to circulate around the rotating member and between the surface and the rotating member, thus efficiently cooling the rotating member and the surface with a quickly flowing fluid. The rotating member has a fluid conduit extending from the rotational center of the rotating member to the outer edge of the rotating member. The cooling fluid inside the fluid conduit is subject to a centrifugal force under the action of the rotational motion, so that the cooling fluid is induced to flow from the rotational center to the outer edge, thus forcing the cooling fluid to circulate.

Magnetron with cooling system for process chamber of processing system

Apparatus, positioned at an inlet port to a pump, for shielding the pump from a process chamber of a semiconductor wafer processing system, where the apparatus has a variable effective throughput area. Specifically, the apparatus is a restrictor shield having a first effective throughput area during processing and a second effective throughput area during bakeout, where the first effective throughput area is typically less than the second effective throughput area. The selection of the effective throughput area is directly responsive to the temperature within the process chamber.

Growing community of inventors

Campell, CA, United States of America

David Datong Huo