Raytheon Company

Texas Instruments Corporation

David D Heston

Jon Mooney

John G Heston

Randall E Lehmann

Claire E Mooney

David J Seymour

Mikel J White

Bryan G Fast

Michael G Hawkins

Thomas L Middlebrook

David R Fletcher

Tiffany E Cassidy

Robert S Isom

Brandon William Pillans

Gordon R Scott

Scott Mitchel Heston

Brian P Helm

Richard G Pierce

William Sheridan Kopp

Jon E Mooney

Thomas L Iii Middlebrook

A free-from radio frequency (RF) media includes a substrate having a first dielectric layer formed thereon and a second dielectric layer on an upper surface of the first dielectric layer. A first conductive layer is formed on an upper surface of the first dielectric layer and has a first overall profile. A second conductive layer having a second overall profile is formed on an upper surface of the second dielectric layer such that the second dielectric layer is interposed between the first and second conductive layers. The first overall profile of the first conductive layer is different from the second overall profile of the second conductive layer.

Free-form dual dual-conductor integrated radio frequency media

An HPA MMIC assembly includes a MMIC device coupled to a thermal spreader. A ground plane is provided on the thermal spreader and coupled to FETs in the MMIC device. The multiple levels of metal separated by multiple dielectric layers provide low-loss broad-band microstrip circuits. The thermal spreader may include diamond, an air/wire-edm spreader or a multi-layer board (MLB) with heat sink vias and ground vias.

Heterogeneous multi-layer MMIC assembly

Guanella topology balun/unun impedance transformer contains cascaded, i.e., series-coupled, coils of different sizes implemented in RF CMOS technology. The cascading of differently-sized coils provides for a large resonance-free operating bandwidth. The shunt inductive loading maximizes low frequency performance.

CMOS Guanella balun

A switchable charge pump (SCP) combines a switching element and a charge pump. An SCP can be utilized within an RF circuit to allow the charge pump to be activated or deactivated in the circuit depending on incident RF power level. Multiple SCPs can be utilized to provide a generalized a single-pole N-throw (SPNT) system architecture. In one example, an RF transmit-receive (T/R) system utilizes SCPs to operate in one of three modes: transmit mode, receive mode, or self-selecting terminate mode.

Transmit-receive system having three operating modes

Switchable charge pump for multi-mode operation

A circuit for amplifying a source signal generated by a signal source having a first impedance includes a transmission line transformer (TLT) having a first, a second, a third, and a fourth port wherein the TLT is coupled to receive the source signal at the first port and configured to output a corresponding impedance matched signal at the second port, the second port is coupled to the third port of the TLT, the circuit also including a TLT load having a first terminal coupled to the fourth port of the TLT and a second terminal coupled to a reference potential. The circuit additionally includes an amplifier device responsive to the impedance matched signal to generate an amplified signal.

Systems for amplifying a signal using a transformer matched transistor

Off-chip distributed drain biasing increases output power and efficiency for high power distributed amplifier MMICs. An off-chip bias circuit has a common input for receiving DC bias current and a plurality of parallel-connected bias chokes among which the DC bias current is divided. The chokes are connected to a like plurality of drain terminals at different FET amplifier stages to supply DC bias current at different locations along the output transmission line. Off-chip distributed drain biasing increases the level of DC bias current that can be made available to the amplifier and add inductances to selected FET amplifier stages, typically the earlier stages, to modify the load impedance seen at the drain terminal to better match the amplifier stages to improve power and efficiency.

Off-chip distributed drain biasing of high power distributed amplifier monolithic microwave integrated circuit (MMIC) chips

A bias circuit includes second order process variation compensation in a current source topology having a compensation transistor operating in saturation mode as a current source. An additional compensation transistor is biased to operate in a linear mode to provide an active resistor to vary a control voltage applied to the saturation mode compensation transistor and widen the range of sourced control current, thus widening the achievable range of the control voltage applied to the biasing transistor to produce a predetermined level of bias current despite process variations. The additional compensation transistor has been shown to be able to compensate for another approximately 20-25% of the induced variations leaving less than approximately 10% and preferably less than 5% variation in the bias current from the predetermined level at certain bias conditions and over typical fabrication process variations.

Bias circuit having second order process variation compensation in a current source topology

A temperature control system having: a resistor formed in a region of a semiconductor, such resistor having a pair of spaced electrodes in ohmic contact with the semiconductor; at least one device formed in another region of the semiconductor thermally proximate the resistor formed region, such device generating heat in the semiconductor; and circuitry, including a reference connected to one of the pair of electrodes, for operating the resistor in saturation and for sensing variation in the resistor in response to the heat generated by the device and for controlling the heat generated by the device in the semiconductor in response to the sensed variation.

Integrated circuit chip temperature sensor

The present invention relates to microwave circuits, and more particularly to bypass circuits for bias connections. The bypass circuit comprises a capacitor in series with an inductor, the series combination being connected between the bias conductor and ground. This series combination provides low return loss at the operating frequency. A de-queueing circuit may be included in the bypass circuit to provide loss at other frequencies.

Resonated bypass capacitor for enhanced performance of a microwave circuit

An integrated circuit resistor is provided that comprises a mesabetween electrical contactsand. The electrical resistance between electrical contactsandis selectively increased through the formation of recessesandin the mesa. The size of recessesandcan be used to tune the value of the electrical resistance between contactsand

Integrated circuit resistor

According to one embodiment of the invention a method for switching an alternating current signal between at least two paths includes providing, in at least one of the paths, first and second field effect transistors in series. The method also includes providing a control voltage node operable to receive a control voltage and maintaining each of the first and second field effect transistors in pinch-off mode by offsetting a voltage on each gate of the field effect transistors with a DC voltage component other than the control voltage when it is desired for the alternating current not to flow through the at least one path.

Method and system for high power switching

According to one embodiment of the invention, a power absorber for receiving a signal having a fundamental frequency includes an input node for receiving the signal and a first PIN diode circuit having a first end electrically connected at the input node and a second end. The first PIN diode circuit includes at least one PIN diode. The absorber also includes a load resistance having a first end electrically connected to the second end of the PIN diode circuit and a second end electrically connected to a reference voltage. The absorber also includes a quarter wave transmission line having a first end electrically connected to the input node at a second end. The quarter wave transmission line has an electrical link that is one quarter of the wavelength of the fundamental frequency. The power absorber also includes a second PIN diode circuit having an input electrically connected to the second end of the quarter wave transmission line and an output electrically connected to the reference voltage. The first choke is provided in parallel with the load resistor.

Power absorber system and method

According to one embodiment of the present invention a method for biasing a power amplifier having at least one transistor exhibiting kink anomaly includes providing a bias circuit coupled to a gate of at least one transistor of the power amplifier. The method also includes providing, by the bias circuit, a bias voltage to the gate. The bias circuit has a load characteristic that intersects a current versus gate voltage curve for the gate at a frequency of operation of the power amplifier only once and that exhibits a low impedance at the intersection of the load characteristic with the current versus gate curve of the gate.

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Dallas, TX, United States of America

David D Heston