Seagate Technology Incorporated

David D Backlund

Andrew Robert Motzko

Eyvand Ernest Toensing

Scott Robert Warmka

Rick Pfahl Freeman

Erik Jon Lindquist

A FOS is provided for electrically connecting a data transfer head with a PCCA. The FOS comprises a polymeric layer supporting an electrical trace. The electrical trace comprises an uninsulated pad surface configured for electrically engaging a solder interconnect of the PCCA. The polymeric layer comprises a continuous portion covering the pad and opposing the pad surface. A method is provided comprising providing the FOS comprising the electrical trace and the polymeric covering, contactingly engaging the pad surface portion of the trace with the solder interconnect portion of the PCCA, and conducting heat through the polymeric covering to reflow the solder interconnect, thereby electrically connecting the FOS to the PCCA.

Flex on suspension with a heat-conducting protective layer for reflowing solder interconnects

A load beam and a disc drive data storage system using the same are disclosed. The load beam includes a resilient section adapted for attachment to a support arm, and a substantially rigid section coupled to the resilient section and coupleable to a gimbal. The resilient and rigid load beam sections are separated by a preload bend. A first slide capture is included on the rigid load beam section and is adapted to slidably secure a conductor sleeve to the rigid section such that the sleeve can move longitudinally therethrough. The first slide capture substantially constrains conductor sleeve movement orthogonal to longitudinal movement. A first longitudinal inhibiting capture is included on the resilient load beam section and is adapted to secure the sleeve to the resilient section such that longitudinal displacement of the conductor sleeve proximate the firsts longitudinal inhibiting capture is constrained.

Disc drive data storage system and load beam having improved captures for routing head wire and tube assembly

A contained instrument cleaner including a housing having an enclosed chamber and an opening sized to insert an instrument. A rigid member having an abrading surface is supported inside the chamber for cleaning debris from an instrument. The device includes a vacuum channel opened to the chamber and coupleable to a vacuum source for removing debris. A method for cleaning an instrument including the steps of inserting an instrument into an enclosed chamber and rubbing the instrument against an abrading member in the enclosed chamber for removing debris. A vacuum is supplied in the enclosed chamber for collecting debris.

Contained instrument cleaner for use in a controlled environment

A soldering device includes an elongated hot bar and a plurality of spaced soldering tips supported along the hot bar for soldering multiple connections. A method of using the soldering device is also described.

Soldering device with a plurality of spaced soldering tips and method of

A soldering member includes an elongated heating element for soldering a series of connectors. The elongated heating element of the soldering member is flexibly supported via a rigid base for adjusting the orientation of the heating element to align with a series of connectors rigidly supported for soldering. A method of using the soldering member is also described.

Device for soldering a series of connectors and a method of use

A soldering device for soldering lead wires from a disc head to a circuit of the disc drive includes a heat shield adapted to provide a protective barrier for a soldering tip during operation of a soldering instrument. During operation, the soldering tip is heated by a heating element for use. A heat shield is coupled with the soldering tip and designed to provide a temperature barrier along the length of the soldering tip and prevent damage to other wires in close proximity.

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Hanover, MN, United States of America

David D Backlund