Siemens Aktiengesellschaft

David Cutter

Hans-Christian Schaber

Werner Baumgartner

Hans Unterberger

Hansjorg Reichert

Josef Binder

Radim Badalec

Frank Mollmer

Wolfgang Henning

Method of joining a semiconductor chip to a chip carrier by cementing or soldering which includes treating an area of the semiconductor chip to be joined to the carrier with a laser beam, adjusting the energy of the laser beam to produce depressions by localizing melting of the semiconductor material of the chip and to at least partially pile melted semiconductor material at the edge of the depression, and applying cement or solder between the treated area of the semiconductor chip and the carrier.

Method for joining a semiconductor chip to a chip carrier

Sensor with polycrystalline silicon resistors which are applied to a substrate and are covered with a dielectric passivating layer, characterized by the feature that the resistors are thermally adapted by targeted adjustment of their dopings and by suitable healing, and are balanced by laser trimming.

Sensor with polycrystalline silicon resistors

A multi-purpose terminal device is adapted for connection to a data processing system, an automatic text processing unit and/or a communication network. An input and control keyboard is provided for controlling connections and for adding information to the information provided by a plurality of devices. A hard copy input is provided and optically coupled to a hard copy output for producing local copies. A branching device connects the hard copy input to an interface with the external units. A memory is also provided for storing data read from masters, buffering data coming from the external units and for intermediate storage of data during processing operations.

Multi-purpose terminal device having an input and control keyboard for

Growing community of inventors

Munich, Germany

David Cutter