Amkor Technology, Inc.

Amkor Technology Singapore Holding Pte. Ltd.

Flipchip International LLC

David Clark

Curtis Michael Zwenger

Theodore Gerard Tessier

A method for manufacturing a semiconductor device and a semiconductor device produced thereby. For example and without limitation, various aspects of this disclosure provide a method for manufacturing a semiconductor device, and a semiconductor device produced thereby, that that comprises a transparent, translucent, non-opaque, or otherwise optically-transmissive, external surface.

Semiconductor device with transmissive layer and manufacturing method thereof

Semiconductor device with optically-transmissive layer and manufacturing method thereof

Semiconductor device and manufacturing method thereof

A process for forming a heat sink on a semiconductor package at the wafer level stage of manufacture is disclosed. A semiconductor component wafer, prior to separation into separate component packages, is covered on one side with a resin metal foil layer. The resin foil layer is patterned by laser ablation to define the heat sink locations, and then a thermal paste is applied over the patterned layer. The thermal conductive paste is hardened to form the heat sinks. The wafer can then be separated into packages.

Wafer level applied thermal heat sink

Growing community of inventors

Ipswich, United Kingdom

David Clark