Funai Electric Company Ltd.

Lexmark International, Inc.

The Procter Gamble Company

David Christopher Graham

Sean Terrance Weaver

David L Bernard

Christopher Allen Craft

Paul William Dryer

Xiaoming Wu

Rich Wells

Gary Anthony Holt, Jr

Joel P Provence

Andrew McNees

Johnny Dale Massie, Ii

Sean Terrence Weaver

Jonathan H Laurer

Bart Mansdorf

Richard D Wells

Tim Frasure

James Daniel Anderson, Jr

Yimin Guan

Jeanne Marie Saldanha Singh

Judith Ann Hollingshead

Kelly Ann Killeen

Brian Christopher Hart

Jiandong Fang

Craig Michael Bertelsen

John William Krawczyk

Xiaorong Cai

Melissa Marie Waldeck

Eric Spencer Hall

Eunki Hong

Mary Claire Smoot

Burton Joyner, Ii

Chisomaga Ugochi Nwachukwu

David Bruce Rhine

Bryan Thomas Fannin

Zach Reitmeier

Elaine Yeap Money

Richard Leo Hubert, Ii

Jacob Boyle

James D Anderson Jr

Christopher A Craft

Joel Provence

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes an array of nozzle holes and a fluid channel layer attached to an exposed surface of the nozzle plate, wherein the fluid channel layer comprises a fluid channel formed in the fluid channel layer adjacent to each nozzle hole for urging fluid from each nozzle hole.

Self-cleaning nozzle plate

A nozzle plate of a fluid ejection head for a fluid ejection device, a fluid ejection head containing the nozzle plate, and a method for making the fluid ejection head containing the nozzle plate. The nozzle plate includes at least two arrays of nozzle holes on opposing sides of a fluid supply via etched in an ejection head substrate and a photoresist layer attached to an exposed surface of the nozzle plate spanning a section of the nozzle plate between the at least two arrays of nozzle holes. The photoresist layer increases a thickness of the nozzle plate between the at least two arrays of nozzle holes to greater than 25 microns up to about 100 microns.

Photoimageable nozzle plate having increased solvent resistance

A microfluidic cartridge is provided. The microfluidic cartridge has an interior and an exterior. The microfluidic cartridge includes a reservoir disposed in the interior of the microfluidic cartridge and configured to contain a fluid composition. The microfluidic cartridge includes an electric circuit disposed on the exterior of the microfluidic cartridge. The electric circuit comprises a first end portion having electrical contacts and a second end portion opposing the first end portion. The microfluidic cartridge includes a microfluidic die disposed on the exterior of the microfluidic cartridge, wherein the microfluidic die is electrically connected with the second end portion of the electric circuit and in fluid communication with the reservoir. A silicone pressure-sensitive adhesive is used to join the electric circuit with the exterior of the microfluidic cartridge.

Microfluidic cartridge comprising silicone pressure-sensitive adhesive

A planarization layer and method therefor. The planarization layer has a thickness ranging from about 2 to about 3 microns, and contains from about 8.0 to about 8.5 wt. % photoacid generator; from about 2 to about 3.6 wt. % photoinitiator; from about 0.35 to about 0.5 wt. % green dye; from about 35 to about 46 wt. % multifunctional epoxy compound; from about 35 to about 50 wt. % of one or more difunctional epoxy compounds; and from about 1 to about 2.6 wt. % silane adhesion promoter, wherein all weight percent is based on a total weight of the layer devoid of solvent.

Photoresist formulation

A fluidic ejection cartridge and protective tape therefor. The cartridge includes a cartridge body for an organic solvent-based fluid having a cover closing a first end thereof, an ejection head on a second end thereof and side walls attached to the first and second ends between the first and second ends. The side walls include a first side wall, a second side wall opposite the first side wall, a first end wall attached to the first and second side walls, and a second end wall opposite the first end wall attached to the first and second side walls. A removable tape is attached to a nozzle plate of the ejection head and to a portion of the first side wall. The removable tape contains a polymeric backing film and a glass-filled, platinum-cured silicone adhesive. The glass-filled, platinum-cured silicone adhesive is cross-linked with silane and a second cross-linking agent.

Sealing tape for organic solvent-based fluidic cartridges

A fluidic ejection cartridge and protective tape therefor. The fluidic ejection cartridge has a cartridge body for an organic solvent-based fluid having a cover closing a first end thereof, an ejection head on a second end thereof opposite the first end, and side walls attached to the first and second ends between the first and second ends, wherein the side walls comprise a first side wall, a second side wall opposite the first side wall, a first end wall attached to the first and second side walls, and a second end wall opposite the first end wall attached to the first and second side walls. A removable tape is attached to a nozzle plate of the ejection head and to a portion of the first side wall, wherein the removable tape comprises a polymeric backing film and a platinum-cured silicone adhesive.

Organic solvent sealing tape

A three-dimensional ('3D') structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first layer devoid of a hydrophobicity agent and (b) at least a second layer comprising the hydrophobicity agent. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material.

Method for manufacturing MEMS devices and nano devices with varying degrees of hydrophobicity and hydrophilicity in a composite photoimageable dry film

A three-dimensional ('3D') structure for handling fluids, a fluid handling device containing the 3D structure, and a method of making the 3D structure. The method includes providing a composite photoresist material that includes: (a) a first photoresist layer derived from a photoresist resin having a first chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density and (b) at least a second photoresist layer derived from a photoresist resin having a second chemical property selected from the group consisting of epoxide equivalent weight, aromatic content, and crosslink density different from the first chemical property. The composite photoresist material is devoid of an adhesion promotion layer between layers of the composite photoresist material and the composite photoresist material has varying mechanical and/or physical properties through a thickness of the 3D structure.

Method to taylor mechanical properties on MEMS devices and nano-devices with multiple layer photoimageable dry film

A fluidic delivery device having improved volumetric efficiency. The device includes a fluid container having a standpipe at a lower end of the container and open areas located below a fluid entrance end of the standpipe; a first fluid permeable body located in the fluid container above the fluid entrance end of the standpipe; and one or more second fluid permeable bodies located in the open areas of the fluid container below the first fluid permeable body and below the fluid entrance end of the standpipe.

Fluid delivery devices

A fluidic delivery device includes a fluid supply containing a fluid, the fluid supply has a fluid reservoir and a pair of fluid permeable compressible bodies located in the fluid reservoir. One of the fluid permeable compressible bodies has an effective greater density than the other fluid permeable compressible body.

Fluid delivery devices having improved efficiency in delivering fluid with reduced wastage of fluid

A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.

Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same

Disclosed is an ejection device for an inkjet printer that includes an ejection chip having a substrate and at least one fluid ejecting element. The ejection device further includes a fluidic structure configured over the ejection chip. The fluidic structure includes a nozzle plate composed of an organic material and includes a plurality of nozzles. The fluidic structure further includes a flow feature layer configured in between the ejection chip and the nozzle plate. The flow feature layer is composed of an organic material and includes a plurality of flow features. Furthermore, the fluidic structure includes a liner layer encapsulating the nozzle plate. The liner layer further at least partially encapsulates each flow feature of the plurality of flow features. The liner layer is composed of an inorganic material. Further disclosed is a method for fabricating the ejection device.

Ejection devices for inkjet printers and method for fabricating ejection devices

A die attach composition is used for bonding a silicon chip on a flat substrate. The die attach composition includes a cross-linkable epoxy resin having a rigid backbone, an epoxy siloxane resin, a fumed silica filler, an amine curing agent, and a silane coupling agent. The die attach composition is particularly useful in bonding silicon heater chips on flat ceramic substrate in forming an inkjet printhead assembly. The die attach composition allows accurate placement of silicon heater chips on flat ceramic substrate and exhibits good ink resistance.

Die attach composition for silicon chip placement on a flat substrate having improved thixotropic properties

Environmentally friendly thick film layers for a micro-fluid ejection head and micro-fluid ejection heads are disclosed. The environmentally friendly thick film layer includes a negative photoresist layer derived from a composition comprising a multi-functional epoxy compound, a low molecular weight polymeric difunctional epoxy compound, a monomeric difunctional epoxy compound, a methide-based photoacid generator that does not contain antimony, a chromophore and an aryl ketone solvent. Optionally the photoresist layer contains an adhesion enhancer. The negative photoresist layer is environmentally friendly and provides good resolution, well defined critical dimensions, straight side walls, and a large processing window.

Formulations for environmentally friendly photoresist film layers

Adhesive compositions, micro-fluid ejection devices, and methods for attaching micro-fluid ejection heads to devices. One such adhesive composition is provided for use in attaching a micro-fluid ejection head to a device, such as to reduce chip bowing and/or to decrease chip fragility upon curing of the adhesive. Such an exemplary composition may include one having from about 50.0 to about 95.0 percent by weight of at least one cross-linkable resin selected from the group consisting of epoxy resins, siloxane resins, urethane resins, and functionalized olefin resins; from about 0.1 to about 25.0 percent by weight of at least one thermal curative agent; and from about 0.0 to about 30.0 percent by weight filler, and exhibit a relatively low shear modulus upon curing (e.g., less than about 10.0 MPa at 25&#xb0; C.).

Growing community of inventors

Lexington, KY, United States of America

David Christopher Graham