Xindium Technologies, Inc.

David Charles Caruth

Milton Feng

Shyh-Chiang Shen

Shyh Chiang

Jeffrey T Feng

An indium phosphide based double hetero-junction bipolar transistor with an increased collector-base breakdown voltage and a reduced operational knee voltage is provided by manipulating the conductivity in the collector region. The collector is formed using layers of different conductivities, with a region of the collector relatively close to the base being unintentionally or low doped. A voltage drop across the unintentionally doped region reduces the maximum value of the electric field and the velocity of carriers injected into the collector region at the base-collector junction. The conductivity throughout the collector region may be graded such that the highest conductivity occurs near the sub-collector and lowest conductivity occurs near the base region.

Collector layer structure for a double hetero-junction bipolar transistor for power amplification applications

An electronic circuit includes a current mirror bias circuit and a power amplifier that has a power transistor for amplifying radio frequency signals such that the output collector current of the power transistor is approximately constant over a wide range of varying power supply voltages. The power transistor is biased by a current mirror biasing circuit that has a reference voltage that maintains the quiescent DC collector current at an approximately constant value. The reference voltage may be varied to provide control of the output power of the power amplifier.

Current mirror biasing circuit with power control for HBT power amplifiers

An expitaxial layer structure that achieves reliable, high speed, and low noise device performance in indium phosphide (InP) based heterojunction bipolar transistors (HBTs) for high data rate receivers and optoelectronic integrated circuits (OEIC). The layer consists of an n&plus; InGaAs subcollector, an n&plus; InP subcollector, an unintentionally doped InGaAs collector, a carbon-doped base, an n-type InP emitter, an n-type InGaAs etch-stop layer, an n-type InP emitter, and anInGaAS cap layer.

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Champaign, IL, United States of America

David Charles Caruth