General Electric Company

Ge Homeland Protection, Inc.

Lockheed Martin Corporation

Morpho Detection, Inc.

David Cecil Hays

Glenn Scott Claydon

Anis Zribi

Stacey Joy Kennerly

Shivappa Ningappa Goravar

Long Que

Shankar Chandrasekaran

Ayan Banerjee

Christopher Fred Keimel

Marco Francesco Aimi

Christopher James Kapusta

Sandip Maity

Oliver Charles Boomhower

Robert J Wojnarowski

Ertugrul Berkcan

Emad Andarawis Andarawis

Arun Virupaksha Gowda

Charles Erklin Seeley

Kanakasabapathi Subramanian

Joseph Alfred Iannotti

Eladio Clemente Delgado

Victor Donald Samper

Marko Klaus Baller

Min-Yi Shih

Todd Ryan Tolliver

Charles Scott Sealing

Sheila Tandon

Nanette Gruber

Dirk Lange

Willam Scott Sutherland

Ayan Banerjec

Shankar (nmn) Chandrasekaran

Robert John Wojnarowski

Oliver Charles Boomhoower

Nanette Judith Gruber

Emad Anadarawis Andarawis

Electrostatic devices, systems and methods are presented. One embodiment is an electrostatic device including a substrate, a first electrode disposed on the substrate, a movable element having a second electrode and a control electrode. The control electrode is disposed in electrostatic communication with the movable element. The control electrode includes a protection layer having resistivity in a range of from about 1 ohm-cm to about 10 kohm-cm.

High voltage switch and method of making

An electrical through-connection, or via, that passes through a substrate to a bus on a first surface of the substrate. The via may be configured with an interlock such that the electrically conductive core of the via is constrained to thermally expand towards the second surface, away from the bus, thus preventing damage to the bus. The interlock may be a local constriction or enlargement of the via near the first surface of the substrate. The via may be greater in length along the bus than a unit spacing of beams in a parallel microswitch array actuated in unison along the bus. The via may be narrower in width than in length, and may form a trapezoidal geometry that is larger at the second surface of the substrate than at the first surface.

Electrical connection through a substrate to a microelectromechanical device

According to one embodiment, a micro-electrical mechanical system apparatus includes (i) a comb drive actuator having at least one irregularly shaped finger and (ii) a movable Fabry-Perot filter cavity mirror coupled to the comb drive actuator. According to some embodiments, a relationship between a voltage applied to the comb drive actuator and an amount of displacement associated with the movable mirror is substantially linear.

Irregularly shaped actuator fingers for a micro-electromechanical system fabry-perot filter

A piezoelectric planar composite apparatus to provide health monitoring of a structure and associated methods are provided. The piezoelectric planar composite apparatus includes a piezoelectric electric material layer, multiple electrodes positioned in electrical contact with the piezoelectric material layer, and multiple sets of electrode interconnect conductors each positioned in electrical contact with a different subset of the electrodes and positioned to form multiple complementary electrode patterns. Each of the complementary electrode patterns is positioned to form an electric field having an electric field axis oriented along a different physical axis from that of an electric field formed by at least one other of the complementary electrode patterns. The interconnect conductors can be distributed over several electrode interconnect conductor carrying layers to enhance formation of the different complementary electrode patterns.

Piezoelectric composite apparatus and related methods

A system and method for managing optical power for controlling thermal alteration of a sample undergoing spectroscopic analysis is provided. The system includes a moveable laser beam generator for irradiating the sample and a beam shaping device for moving and shaping the laser beam to prevent thermal overload or build up in the sample. The moveable laser beam generator includes at least one beam shaping device selected from the group consisting of at least one optical lens, at least one optical diffractor, at least one optical path difference modulator, at least one moveable mirror, at least one Micro-Electro-Mechanical Systems (MEMS) integrated circuit (IC), and/or a liquid droplet. The system also includes an at least two degree of freedom (2 DOF) moveable substrate platform and a controller for controlling the laser beam generator and the substrate platform, and for analyzing light reflected from the sample.

System and method for optical power management

Multiple microelectromechanical systems (MEMS) on a substrate are capped with a cover using a layer that may function as a bonding agent, separation layer, and hermetic seal. A substrate has a first side with multiple MEMS devices. A cover is formed with through-holes for vias, and with standoff posts for layer registration and separation. An adhesive sheet is patterned with cutouts for the MEMS devices, vias, and standoff posts. The adhesive sheet is tacked to the cover, then placed on the MEMS substrate and heated to bond the layers. The via holes may be metalized with leads for circuit board connection. The MEMS units may be diced from the substrate after sealing, thus protecting them from contaminants.

Sealed wafer packaging of microelectromechanical systems

According to one embodiment, a micro-electrical mechanical system apparatus includes first and second mirrors that define a cavity. Moreover, a photonic band-gap structure coats a surface of at least one of the first or second mirrors to improve reflectivity. Another embodiment includes a third mirror, wherein the second and third mirrors form a second cavity. The spaces between the mirrors might comprise, for example, a pair of Fabry-Perot filter cavities for a spectrometer.

Micro-electromechanical system Fabry-Perot filter mirrors

According to one embodiment, a micro-electrical mechanical system apparatus includes a bi-stable actuator and at least one movable Fabry-Perot filter cavity mirror coupled to the bi-stable actuator. The bi-stable actuator may be associated with a first latched position and a second latched position and may comprise, for example, a thermal device, an electrostatic device (e.g., a parallel plate or comb drive), or a magnetic device. According to some embodiments, a relationship between a voltage applied to an actuator of a Fabry-Perot filter and an amount of displacement associated with a movable mirror is substantially linear.

Actuator for micro-electromechanical system fabry-perot filter

An integrated spectrometer instrument, including an optical source formed on a chip, the optical source configured to generate an incident optical beam upon a sample to be measured. Collection optics formed on the chip are configured to receive a scattered optical beam from the sample, and filtering optics formed on the chip are configured to remove elastically scattered light from the scattered optical beam at a wavelength corresponding to the optical source. A tunable filter formed on the chip is configured to pass selected wavelengths of the scattered optical beam, and a photo detector device formed on the chip is configured to generate an output signal corresponding to the intensity of photons passed through the tunable filter.

Compact, hand-held raman spectrometer microsystem on a chip

A photonic crystal based collection probe is provided. The probe includes a photonic crystal configured to guide and condition a beam of Raman scattered photons. Further, the device includes a spectrograph in optical communication with the photonic crystal and configured to receive Raman scattering from the photonic crystal. The device may be employed in a Raman spectrometer system.

Collection probe for use in a Raman spectrometer system and methods of making and using the same

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Niskayuna, NY, United States of America

David Cecil Hays