Nxp B.v.

David Ceccarelli

Christian Zenz

Tonny Kamphuis

Heimo Scheucher

Guido Albermann

Bodin Kasemset

Johannes Wilhelmus Van Rijckevorsel

Boudewijn Van Blokland

Patrick Schoengrundner

Dual-interface Integrated Circuit (IC) card components and methods for manufacturing the dual-interface IC card components are described. In an embodiment, a dual-interface IC card component includes a single-sided contact base structure, which includes a substrate with an electrical contact layer. On the single-sided contact base structure, one or more antenna contact leads are attached to the single-sided contact base structure to form a dual-interface contact structure, which is a component of a dual-interface IC card. Other embodiments are also described.

Dual interface IC card components and method for manufacturing the dual-interface IC card components

Integrated circuits () on a wafer comprise a wafer substrate () and a structure applied on a surface () of the wafer substrate (). The structure forms a plurality of integrated circuits () formed on the wafer substrate () and the integrated circuits () are separated by saw lines (). The structure comprises a plurality of superposed layers (-) formed on the wafer substrate () and a top layer () formed on the superposed layers (-). The integrated circuit () on the wafer further comprise a plurality of alignment marks () intended for aligning a separating device () for separating the integrated circuits () on the wafer into individual integrated circuits () during a separation process, wherein the alignment marks () are formed from at least one of the superposed layers (-).

Integrated circuits on a wafer and method for separating integrated circuits on a wafer

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Hitzendorf, Austria

David Ceccarelli