Sierra Wireless, Inc.

David Caesar

Behrouz Pourseyed

Riley Hoyt

Steven Lawrence Gielty

Dan Florescu

Method and apparatus for selectively connecting one of an internal and an external antenna to an RF signal component of a wireless modem use a sensor mounted on the circuit board of the wireless modem. The sensor senses the presence of a connector of the external antenna, and issues a corresponding sensor output signal to a controller that controls a switch in order to alternatively connect one of the internal and external antennas to the RF signal component.

Method and apparatus for switching between internal and external antennas in a device such as PC-Card modem

A solution is provided wherein the mobile device selects a multislot class based on the profile of the traffic to be utilized by the mobile device. This may be performed manually by a user, or may be performed automatically where an application or driver software automatically and dynamically determines the best multislot class for the applications being used. This can be accomplished, for example, by looking at the classification of the transport control protocol (TCP) port numbers used, by examining the data sent and received by the network, and/or looking up a profile for the user or device. If the user changes applications or some other event occurs on the mobile device that might cause a change in the profile of the traffic, the mobile device may terminate its current multislot class assignment and re-announce itself, allowing the system to transfer the mobile device to a new multislot class.

Configurable multislot class for wireless devices

An apparatus and method for providing a broadband antenna is disclosed. For one embodiment of the invention, a molded antenna structure is provided having a gap between electrical components on the printed circuit assembly (PCA) and an overmolding of the antenna structure. One embodiment of the invention substantially reduces the degradation of the antenna performance in wideband modes of operation compared with prior art overmolding schemes. For one embodiment of the invention, the gap between the electrical components and the overmolding is formed by implementing a 'cap' (covering) over the components on the PCA such that they are substantially surrounded by air between the cap and the PCA surface.

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Vancouver, Canada

David Caesar