US Government As Represented by the Secretary of the Army

General Electric Company

Rca Inc.

David C Smith

Richard Noto

Stephen A McNeary

Rathindra N Putatunda

Gregory C Burke

Richard A Beyer

Henry Kerwien

John J O'Reilly

Richard W Helmke

Mark Todaro

Mark P Levine

A window assembly for transmitting light into and from a vessel containing a high pressure, high temperature, highly reactive environment includes a truncated conical window which is substantially transparent to radiation, a truncated conical metal seal which circumferentially engages the window, and a case to which the window and the seal are secured. To facilitate automatic cleaning of the window, the surface of the window which is exposed to the high-pressure environment is seated substantially flush with the high-pressure surface of the case. By initially seating the window assembly by means of mechanical pressing, then subjecting the window assembly to a series of successively higher transient combustion pressures, a window assembly can be fabricated which can withstand prolonged service in a harsh environment such as that encountered in a large caliber artillery cannon or equivalent scientific and industrial applications.

High pressure, high temperature window assembly and method of making the same

A modular lightweight bridge comprises a pair of tubular truss formed spans, each of which include a plurality of modules hinged to one another at locations on the bottom of the bridge for folding the bridge for transport prior to deployment of the bridge. Each span has a unique high strength fabric deck or roadway surface tensioned across the upper side of the truss chord members. The bridge is uniquely captively mounted on a trailer by rollers for transporting the bridge when it is in its folded mode. When the bridge is to be deployed, each span is unfolded by pivoting the modules with respect to one another about vertical axes so that the spans expand longitudinally with respect to the trailer. The spans are then pivoted 90.degree. downwardly about longitudinally extending horizontal axes and the bridge rolled rearwardly from the trailer over the gap to be spanned. Due to the unique captive roller interconnection between the bridge assembly and its transport-deployment trailer, the trailer can thereafter be stored beneath the deployed bridge hanging down into the gully or gap. When a decision is made to remove the bridge, the trailer can be towed from either side back over the bank of the gap and the bridge refolded for mounting on and transport by the trailer.

Lightweight, collapsible bridge module, and system with deployment and

A chip layout system lays out chips including adjustable-shaped domains of standard cells and fixed-size macrocells. The system orders those standard cells which have interconnections into binary pairs or groupings of two. The binary pairs are grouped in higher and higher order groupings based upon evaluations of the area of the grouping and the sum of the lengths of the interconnections. All possible permutations of placement configuration including some rotations of various elements are further evaluated and the final placement is established on the basis of a minimum area, minimum interconnect length criterion. During the processing, the aspect ratios of the various domains and grouping of domains are adjusted to optimize their placement on the chip surface.

Structured design method for high density standard cell and macrocell

An automated LSI chip layout arrangement includes automated layout of the power bus distribution network. A complete interlocking mesh of buses is run in routing channels lying between groups of circuits to be powered. Each segment of the mesh powering net which affects the chip size is tested to see if it can be removed without adversely affecting the power distribution. If it can be removed, the segment is deleted. The next segment which is critical to the size of the chip is then tested, and the process is continued. Those segments of the power bus distribution network which do not affect the size of the chip are not eliminated. Thus, a low-resistance power distribution bus network is guaranteed, and chip size is minimized.

Structured design method for generating a mesh power bus structure in

An improved automatic placement process for placing logic cells in a universal array. Unused basic units are assigned to rows to reduce the congestion of the wiring in high congestion regions of a universal array. These assigned unused basic units are allocated among rows in a pyramidal manner. Those unused basic units allocated to a given row are distributed along that row in a manner to reduce wiring congestion. During a pair exchange portion of the placement process, quality criteria used for deciding whether to exchange two logic cells on different rows include skipped rows in a node, y-span of a node, minimizing the number of logic cells in excess of two in a node on a row, making a longest row shorter and making longer a shortest row or one which is within a tolerance of being a shortest row.

Logic cell placement method in computer-aided-customization of universal

A routing process for automatic computer aided routing of customizing conductors in a universal array which has a single customizing conductive layer is improved by executing a pathfinding routing process for conductors which connect pins on the same row before routing other conductor types. Routing of conductors which connect a pin on the side surface to a pin in the basic unit row region is improved by initially restricting permissible routes to be within a set of three contiguous rectangles. Routing opportunities for potentially failed conductors are increased by allowing customizing conductors to extend parallel to the length of the basic unit rows in the region between adjacent tunnel ranks in the final routing step. An improved custom IC results. The conductor number of the shortest and the longest conductor in each class is stored separately from the routing grid matrix so that these numbers can be directly retrieved as needed. Since the conductors are arranged in class and length order in the wiring matrix, the routing process in going through any class of conductors in an attempt to route them retrieves them in a length order (long-to-short or short-to-long).

Routing method in computer-aided-customization of universal arrays and

A routing method implemented in the stored programs of a digital computer ich is programmably operated to generate the wire interconnect masks for a two level metallization automated universal array having undefined roadbeds between rows of cells comprised of identical semiconductor device basic units which are further interconnected to provide a particular integrated circuit structure. Conductor routing is provided by a computer aided design system that, among other things, carries out a route analysis process which determines in which roadbed each wire should be tentatively routed in conjunction with generating a routing density profile for minimizing congestion for a particular circuit design and when the roadbed density is exceeded, certain wires are removed under a set of criteria for routing by a pathfinder routing process. Following route analysis, detailed routing and rerouting is performed sequentially by a direct routing process, a greedy channel routing process, and a pathfinder routing process with rerouting being performed after each channel router and pathfinding process. Furthermore, the greedy channel routing process makes a single pass from left to right in all wires which cross successive points simultaneously and, if necessary, deleting a wire or wires which are then rerouted by the pathfinding process.

Routing method in computer aided customization of a two level automated

A computer program for the fully automatic layout of hybrid microcircuits. he program, under certain options, guarantees one-hundred percent routing connectivity for components ranging from discretes to VLSI. Special features such as bottom-up or top-down routing, sequential level routing and user-defined grid spacing provide extensive design flexibility.

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Williamstown, NJ, United States of America

David C Smith