George Koch Sons LLC

Ciba-geigy Corporation

David C Siemers

Jeffrey L Dexter

Donald E Miller

Larry J Head

Daniel Stuart Wolff

James L Isonhood

Diethard Kapp-Schwoerer

William Nowack

Bruce Grebe

Environmental enhancement by controlling volatile organic compound (VOC) and NO.sub.x emissions in a flatline wafer drying system. The method is characterized by advancing the wafers of the type used in manufacture of oriented strand board (OSB) on a flatline conveyor embodying a plurality of dryer zones. Particularly, heating the dryer zones in successive lower temperatures in the range 500.degree. F. to 200.degree. F. by flowing heated air upwardly through the flatline wafer drying conveyor; removing VOC-rich exhaust air from a primary dryer zone while flowing heated air upwardly therein and removing VOC-rich exhaust air from a secondary dryer zone while flowing heated air from therein.

Multi-zone method for controlling voc and nox emissions in a flatline

A coater is provided for coating objects with a liquid material. The coater includes a flume that has an entry and an exit end, a supply of liquid coating material upon which the objects float, and a circulation system. The circulation system delivers the liquid material to the entry end of the flume so that the liquid material flows toward and out the exit end. The coater also includes a conveyor that loads the objects into the flume and a conveyor that receives the objects at the exit end of the flume.

Flume coater

Drying of particulate materials, such as wood chips (wafers/strands) for the manufacture of oriented structural board, as well as bark, and the like. The method is characterized by advancing wafers in random array and superposed and without contact above a planar surface; forcing heated air upwardly through spaced apart holes defined in the stationary planar surface and through the random array of advancing wafers, while evacuating heated air and accumulated moisture above the advancing wafers. The method is distinguished by lateral shielding during forcing of heated air above the planar surface, so as to inhibit 'blow-holes' among the drying wafers.

Flatline method of drying wafers

A process for producing thin photoresists on printed circuit boards wherein a metallic-layered substrate is conveyed beneath a free falling curtain of a photopolymerizable substance, said substance having a viscosity of 30-120 seconds DIN cup 4 @ 25.degree. C. and being applied at a curtain height of 5-25 cm. above the board to form a coating having a dry film thickness up to about 1.5 mil after the coated surfaces are dried, whereupon the surfaces are available for photoimaging, developing, etching and stripping operations.

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Evansville, IN, United States of America

David C Siemers