Kollmorgen Technologies Corporation

Bell Telephone Laboratories

Amp-akzo Corporation

David C Frisch

Wilhelm Weber

Louis Thomas Manzione

Gerhard W Poelzing

A process for bonding metal directly to thermoplastic polymeric base materials and a process for producing printed circuits from such metal clad thermoplastic polymeric base materials are provided. The invention also includes the articles so produced. Metal clad thermoplastic polymeric base materials are produced by laminating a metal foil or sheet to thermoplastic polymeric base material, under pressure, at a temperature from about 2.degree. C. to about 45.degree. C. above the glass transition temperature (Tg) of the thermoplastic. The polymeric material is free of volatile materials such as moisture or solvents when laminated.

Process for the production of metal clad thermoplastic base materials

An article comprised of a body having a conductor pattern on at least one non-planar and non-flexible surface thereof. The article is prepared by using a three-dimensional mask having an interior surface which is a mirror image replica of the surface of the body on which the conductors are to be formed. The surface of the body is provided with material which is capable of initiating conductor formation. The interior surface of the mask then is placed over the body and in substantial registry therewith. The mask and the body then are exposed to radiation or moving material to delineate the conductor pattern. Subsequently, the mask is removed and conductors are formed.

Process for producing conductor patterns on three dimensional articles

Catalytically imaged thermosetting and thermoplastic resin objects including printed circuit boards are provided. A hydrophilic, adhesion promoted insulating base material is treated in selected areas to produce metallic nuclei in the form of an image of a desired metal pattern. The image is exposed to an electroless metal bath to reinforce the image. Then, the non-imaged areas of the base are rendered hydrophobic by means of solvent treatment. The imaged areas are built up by metal deposition. Preferably, the solvent treatment of the non-imaged areas of the base material is repeated to enhance adhesion of the metal pattern to the base material.

Process for the photoselective metallization on non-conductive plastic

A method of rapidly relieving stress in an extruded or molded polymer article is disclosed. The method can be used in the preparation of printed circuit boards. An article comprised of the polymer is exposed to electromagnetic radiation, for a time period sufficient to absorb enough energy to stress relieve the polymer against stress cracking therein. Exposure occurs at one or more ranges of frequencies which are capable of being absorbed by the polymer and which are effective for stress relieving without or substantially without causing heat induced softening or flowing of the polymer. The electromagnetic radiation is selected from the ranges of infrared, microwave or ultraviolet radiation.

Radiation stress relieving of polymer articles

A method of rapidly relieving stress in an article comprised of a sulfone polymer is disclosed. The method can be used in the preparation of printed circuit boards. An article comprised of a sulfone polymer is exposed to electromagnetic radiation, for a time period sufficient to absorb enough energy to stress relieve the sulfone polymer against stress cracking therein. Exposure occurs at one or more ranges of frequencies which are capable of being absorbed by the sulfone polymer and which are effective for stress relieving without or substantially without causing heat induced softening or flowing of the sulfone polymer. The electromagnetic radiation is selected from the ranges of infrared, microwave and ultraviolet radiation.

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Baldwin, NY, United States of America

David C Frisch