Applied Materials, Inc.

David C Duffin

Amitabh Puri

Michael Teferra

Daniel R Jessop

Glade L Warner

Todd J Brill

Eric Andrew Englhardt

In one aspect, a method is provided for electronic device manufacturing. The method includes receiving a request to transfer a carrier to or from a first substrate loading station of an electronic device manufacturing facility, and assigning one of a plurality of carrier supports to carry out the transfer based on a spacing on either side of the assigned carrier being greater than an acceptable spacing. Numerous other aspects are provided.

Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility

In at least one aspect, the invention provides an electronic device fabrication facility (Fab) that uses small lot carriers that may be transparently integrated into an existing Fab that uses large lot carriers. A manufacturing execution system (MES) may interact with the inventive small lot Fab as if the small lot Fab is any other Fab component in an existing large lot Fab without requiring knowledge of how to control small lot Fab components (e.g., beyond specifying a processing recipe). A small lot Fab according to the present invention may encapsulate the small lot Fab's internal use of small lot components and present itself to a large lot Fab's MES as if the small lot Fab is a component that uses large lot carriers.

Methods and apparatus for integrating large and small lot electronic device fabrication facilities

Methods and apparatus are provided for managing movement of small lots between processing tools within an electronic device manufacturing facility. In some embodiments, a number of priority lots to be processed is determined and an equivalent number of carrier storage locations are reserved at a substrate loading station of a processing tool. The number of reserved carrier storage locations are made available either by processing and advancing occupying non-priority lots and/or moving unprocessed occupying non-priority lots from the substrate loading station. Priority lots are then transferred to the reserved carrier storage locations. Other embodiments are provided.

Methods and apparatus for material control system interface

In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of substrate loading stations, wherein the facility further includes a plurality of carrier supports coupled to a conveyor system adapted to move the carrier within the facility; (2) assigning one of the plurality of carrier supports to transfer the carrier from the first substrate loading station to the second substrate loading station such that at least one of a time required for the transfer is reduced and balance of the conveyor system is maintained; (3) moving the carrier from the first substrate loading station; and (4) moving the carrier to the second substrate loading station. Numerous other aspects are provided.

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Sandy, UT, United States of America

David C Duffin