Oracle America, Inc.

Thinking Machines Corporation

Oracle International Corporation

Bea Systems, Inc.

T. M. Patents, L.p.

Other

Sun Microsystems, Inc.

American Tire Distributors, Inc.

David C Douglas

W Daniel Hillis

Robert J Drost

Mahesh N Ganmukhi

Shaw-Wen Yang

Charles E Leiserson

Jeffrey V Hill

Bradley C Kuszmaul

Monica C Wong-Chan

Kenneth R Traub

John A Harada

Robert C Zak, Jr

Chet Birger

Steven Rosenthal

Guy Lewis Steele, Jr

Ronald Ho

Daniel R Cassiday

Yuan Gao

Bruce M Guenin

Anthony N Eberhardt

Jing Shi

Jon P Wade

Brewster A Kahle

David S Wells

Robert D Lordi

Bruce J Walker

Linda Bernardi

Carl R Feynman

Zahi S Abuhamdeh

Margaret A St Pierre

Scott J Smith

Henry Bono

Radia Joy Perlman

Stephen R Hanna

Ivan Shubin

Matthew David Giere

Iwao Hatanaka

Anne H Anderson

James Wallace Sarrett

Yassir K Elley

David W Copeland

Mark E Duttweiler

James G Mitchell

Sean J Mullan

David Potter

Jeffrey D Carpenter

Kenneth W Crouch

Darko R Popovic

Alexander D Vasilevsky

Theresa Y Sze

Shaw W Yang

David P Christman

Bradley C Kuzmaul

John J Earls

Monica C Wong

Robert C Zak

Scott D Abrutyn

The disclosed technology includes a system comprising a tire-mounted inertial measurement unit (IMU). The IMU can be configured to measure linear acceleration data and angular velocity data associated with a tire, and the system can be configured to determine various indicators of tire health based on the linear acceleration data and angular velocity data. The system can be configured to determine a distance between the IMU and an outer rolling surface of the tire. The system can be configured to monitor changes in this distance over time, which can be indicative of tread wear over time. Accordingly, the system can be configured to monitor change in the tread depth over time such that the system is configured to monitor tread depth of the tire.

Tire health monitoring systems and methods thereto

A winged heat sink includes one or more arms that transport heat from a pedestal that is thermally coupled to an integrated circuit to convective fins. For example, the one or more arms may include one or more heat pipes. Moreover, the arms extend the vertical position of the winged heat sink away from a plane of the pedestal so that the convective fins extend downward back toward a circuit board on which the integrated circuit is mounted. These downward facing fins may match the topologies of components on the underlying circuit board.

Winged heat sink

A system for controlling an atmospheric condition. The system includes: a pre-atmospheric conditioner configured to: collect ambient air and generate test air comprising the atmospheric condition for a first test computing device by modifying the ambient air. The system also includes an intake conduit, external to the first test computing device, configured to channel the test air to the first test computing device.

Managing atmospheric conditions of a test computing device

A system for controlling an atmospheric condition. The system includes: an exhaust conduit, external to a first test computing device, configured to channel exhaust from the first test computing device. Further, the system includes a primary atmospheric conditioner, external to the first test computing device, configured to generate test air comprising the atmospheric condition for the first test computing device by modifying the exhaust. Further still, the system also includes an intake conduit, external to the first test computing device, configured to channel the test air to the first test computing device.

Setting atmospheric conditions for a test computing device

A fire-protection mechanism is described. The fire-protection mechanism includes multiple, overlapping cavities that can be filled with water (and, more generally, a fluid). When the fire-protection mechanism is deployed over an object, such as a building, and the cavities are filled with water, the fire-protection mechanism reduces the likelihood that the object is damaged by the heat associated with a fire proximate to the object, such as a wild fire. In particular, the heat capacity and latent heat of the water significantly increase the thermal time constant of the object, thereby reducing the likelihood of combustion. The fire-protection mechanism may include a reflective coating to redirect infrared radiation away from the object to provide further protection. In addition, the water in the cavities may be refilled, as needed, by directing a stream of water onto the fire-protection mechanism and/or through an internal channel in the fire-protection mechanism.

Fire-protection mechanism

A multi-chip module (MCM) is described. This MCM includes two substrates, having facing surfaces, which are mechanically coupled. Disposed on a surface of a first of these substrates, there is a negative feature, which is recessed below this surface. A positive feature in the MCM, which includes an assembly material other than a bulk material in the substrates, at least in part mates with the negative feature. For example, the positive feature may be disposed on the surface of the other substrate. Alternatively, prior to assembly of the MCM, the positive feature may be a separate component from the substrates (such as a micro-sphere). Note that the assembly material has a bulk modulus that is less than a bulk modulus of the material in the substrates. Furthermore, at least a portion of the positive feature may have been sacrificed when the mechanical coupling was established.

Assembly of multi-chip modules using sacrificial features

A chip package is described. This chip package includes a stack of semiconductor dies or chips that are offset from each other, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, electrically couples to the exposed pads. For example, the ramp component may be electrically coupled to the semiconductor dies using: microsprings, an anisotropic film, and/or solder. Consequently, the electrical contacts may have a conductive, a capacitive or, in general, a complex impedance. Furthermore, the chips and/or the ramp component may be positioned relative to each other using a ball-and-pit alignment technique. By removing the need for costly and area-consuming through-silicon vias (TSVs) in the semiconductor dies, the chip package facilitates chips to be stacked in a manner that provides high bandwidth and low cost.

High-bandwidth ramp-stack chip package

In a chip package, semiconductor dies in a vertical stack of semiconductor dies or chips (which is referred to as a 'plank stack') are separated by a mechanical spacer (such as a filler material or an adhesive). Moreover, the chip package includes a substrate at a right angle to the plank stack, which is electrically coupled to the semiconductor dies along an edge of the plank stack. In particular, electrical pads proximate to a surface of the substrate (which are along a stacking direction of the plank stack) are electrically coupled to pads that are proximate to edges of the semiconductor dies by an intervening conductive material, such as: solder, stud bumps, plated traces, wire bonds, spring connectors, a conductive adhesive and/or an anisotropic conducting film. Note that the chip package may facilitate high-bandwidth communication of signals between the semiconductor dies and the substrate.

Chip package with plank stack of semiconductor dies

An assembly component and a technique for assembling a chip package using the assembly component are described. This chip package includes a set of semiconductor dies that are arranged in a stack in a vertical direction, which are offset from each other in a horizontal direction to define a stepped terraced at one side of the vertical stack. Moreover, the chip package may be assembled using the assembly component. In particular, the assembly component may include a housing having another stepped terrace. This other stepped terrace may include a sequence of steps in the vertical direction, which are offset from each other in the horizontal direction. Furthermore, the housing may be configured to mate with the set of semiconductor dies such that the set of semiconductor dies are arranged in the stack in the vertical direction. For example, the other stepped terrace may approximately be a mirror image of the stepped terrace.

Manufacturing fixture for a ramp-stack chip package using solder for coupling a ramp component

A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a stepped terrace. A high-bandwidth ramp component, which is positioned approximately parallel to the stepped terrace, is mechanically coupled to the semiconductor dies. Furthermore, the ramp component includes an optical waveguide that conveys the optical signal, and an optical coupling component that optically couples the optical signal to one of the semiconductor dies, thereby facilitating high-bandwidth communication of the optical signal between the semiconductor die and the ramp component.

Optical communication in a ramp-stack chip package

A ramp-stack chip package is described. This chip package includes a vertical stack of semiconductor dies or chips that are offset from each other in a horizontal direction, thereby defining a terrace with exposed pads. A high-bandwidth ramp component, which is positioned approximately parallel to the terrace, is electrically and mechanically coupled to the exposed pads. For example, the ramp component may be coupled to the semiconductor dies using: solder, microsprings and/or an anisotropic conducting film. Furthermore, each of the semiconductor dies includes a static bend so that an end segment of each of the semiconductor dies is parallel to the direction and is mechanically coupled to the ramp component. These end segments may facilitate high-bandwidth communication of signals between the chips and the ramp component, for example, via proximity communication.

Ramp-stack chip package with static bends

A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. The identity-based communications layer is situated between a network layer and an application layer and transmits a message between two devices identified by a global address. The global address specifies a protocol, a network, and an address meaningful for the combination of the protocol and the network.

Using an identity-based communication layer for computing device communication

A computer architecture for enterprise device applications that provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. The unique identity is independent of a network-address. Security information and a network address may be associated with the unique identity.

Identifying a computer device

One embodiment of the present invention provides a system that automatically detects and corrects a misalignment of a semiconductor chip. During operation, the system uses a position-detection mechanism integrated with the chip to determine the misalignment of the chip from a desired alignment for the chip. Next, the system uses an actuation mechanism integrated with the chip to automatically correct the misalignment, thereby improving performance and reliability of the chip.

Method and apparatus for automatically detecting and correcting misalignment of a semiconductor chip

A computer architecture for enterprise device applications provides a real-time, bi-directional communication layer for device communication. An identity-based communications layer provides for secure, end-to-end telemetry and control communications by enabling mutual authentication and encryption between the devices and the enterprise. A unique identity is assigned to each device, user and application to provide security services. Telemetry data is communicated between a data producing device and a data receiving device. The telemetry data sent from the data producing device is identified using the identity identifier of the data producing device.

Communicating data from a data producer to a data receiver

Growing community of inventors

Palo Alto, CA, United States of America

David C Douglas