Alliant Techsystems Inc.

Swales & Associates, Inc.

Orbital Atk, Inc.

Northrop Grumman Innovation Systems, Inc.

David C Bugby

Edward J Kroliczek

David A Wolf, Sr

James S Yun

Walter R Zimbeck

Jessica Maria Kester

Jessica Maria Garzon

Charles Stouffer

A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The condensing unit includes a thermal capacitance device and a condenser integrated with the thermal capacitance device. Methods of forming a thermal storage unit include preparing a honeycomb core to receive a phase change material, metallurgically bonding end pieces to the core, to thermally link the end pieces to the core, and bonding the end pieces together to form a seal for holding the phase change material within the core.

Methods of forming a thermal storage unit

Two-phase heat transfer system including a thermal capacitance device

A system includes a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Thermal management systems including venting systems

An evaporator includes a liquid barrier wall made of a ceramic material, a vapor barrier wall made of a ceramic material, and a wick made of a ceramic material and being positioned between the liquid barrier wall and the vapor barrier wall.

Evaporators for use in heat transfer systems, apparatus including such evaporators and related methods

A system including a primary evaporator facilitating heat transfer by evaporating liquid to obtain vapor is disclosed. The primary evaporator receives a liquid from a liquid line and outputs the vapor to a vapor line. The primary evaporator also outputs excess liquid received from the liquid line to an excess fluid line. A condensing system receives the vapor from the vapor line, and outputs the liquid and excess liquid to the liquid line. The excess liquid is obtained at least partially from a reservoir. A primary loop includes the condensing system, the primary evaporator, the liquid line, and the vapor line, and provides a heat transfer path. Similarly, a secondary loop includes the condensing system, the primary evaporator, the liquid line, the vapor line, and the excess fluid line. The secondary loop provides a venting path for removing undesired vapor within the liquid or excess liquid from the primary evaporator.

Thermal management systems

A two-phase heat transfer system includes an evaporator unit configured to receive heat from a source, a liquid line fluidly connected to the evaporator unit, a vapor line fluidly connected to the evaporator unit, and a condenser. The evaporation unit includes a thermal capacitance device and an evaporator integrated with the thermal capacitance device.

Evaporator for use in a heat transfer system

Thermal management system

A bond joint and process of bonding metal parts to one another to form seamless, hollow metal articles, particularly made from beryllium. Tooling is assembled to the parts, prior to hot pressing, to cause pressure to be applied to flanges that extend peripherally from the parts. The parts, assembled together with the tooling, are then subjected to hot isostatic pressing of the flanges at a temperature of about 1700&#xb0; F. to 1750&#xb0; F., and at a pressure of about 2000 psi to 2500 psi, for around 3 hours. The tooling surrounding the metal parts functions to limit the amount of compression of the flanges. Articles formed by this process are particularly useful in space flight applications because they are formed of a homogeneous material. This means that the articles can operate under high pressure despite being subjected to temperature cycling. Strength of the bond joint is enhanced because no filler metal is used. The absence of a filler metal also eliminates any thermal stress problems as a result of differences in coefficients of thermal expansion.

Growing community of inventors

Vienna, VA, United States of America

David C Bugby