Equinix, Inc.

David Buck Mar

Tikhon Suresh Pichai

Douglas James Asay

My Dinh Truong

David James Asher Hall

Bhavin Raju Shah

A system including a computing device including a chassis and one or more components. The computing device also including a chip assembly positioned within the chassis. The chip assembly including at least one component of the one or more components of the computing device and a pressure chamber adjacent to the at least one component, wherein the pressure chamber is hermetically sealed and contains a fluid mixture configured to facilitate convective cooling of the at least one component.

Hybrid immersion cooling system

A power supply system includes a multitude of independent electrical systems each comprising one or more power blocks, wherein each power block is configured to provide a respective power output and a converter comprising a multitude of inputs coupled to the multitude independent electrical systems and comprising a multitude of outputs coupled to a multitude of independent loads, the converter configured to aggregate the power output of each of the multitude of independent electrical systems and to output direct current (DC) power to the multitude of independent loads through the multitude of outputs based on the aggregated power output. The power supply system includes a power controller coupled to the converter and configured to allocate power to each of the multitude of independent loads based on input power from each of the multitude of independent electrical systems and power consumption from each of the multitude of independent loads.

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San Jose, CA, United States of America

David Buck Mar