Lexmark International, Inc.

Funai Electric Company Ltd.

David Bruce Rhine

Paul William Dryer

Sean Terrance Weaver

James M Mrvos

Jeanne Marie Saldanha Singh

Andrew McNees

Girish Shivaji Patil

Xiaoming Wu

David Christopher Graham

John William Krawczyk

Anna Marie Pearson

Christopher Allen Craft

Karthik Vaideeswaran

Christopher John Money

Richard D Wells

Joel P Provence

A fluid ejection chip and associated methods of forming are disclosed. According to an exemplary embodiment, the fluid ejection chip comprises a substrate, a flow feature layer, and a nozzle layer. The flow feature layer is disposed over the substrate and has an exposed hydrophilic surface layer with an ink contact angle of about 80 degrees. The nozzle layer is disposed over the flow feature layer and has a thickness of about 4 microns to about 8 microns and an exposed hydrophobic surface layer having an ink contact angle of about 115 degrees.

Fluid ejection chip including hydrophilic and hydrophopic surfaces and methods of forming the same

A spray coatable adhesive composition used for bonding silicon dies to a rigid substrate, preferable a silicon substrate is disclosed. The adhesive composition includes an epoxy based resin, a thermal acid generator, a photoacid generator and a solvent. The epoxy based resin includes a mixture of a solid bisphenol A epoxy resin and a liquid or semi-liquid hydrogenated bisphenol A epoxy resin at a weight ratio ranging from about 80:20 to about 65:35. The adhesive composition has a low viscosity which allows it to be spray coated on a rigid substrate and form thin film adhesive which allows silicon dies to be bonded with precise placement on the silicon substrate.

Spray coatable adhesive for bonding silicon dies to rigid substrates

The present disclosure provides a method of cleaning a semiconductor substrate after a DRIE etch process, wherein residue from the DRIE process is removed without damaging the substrate. The process may include contacting the micro-fluid ejection head with an aqueous solution of TMAH, stripping a photoresist etch mask from the micro-fluid ejection head, and dissolving a passivating coating from the substrate. Then the substrate may be contacted with an acidic solution. The method may further include rinsing and drying the substrate.

Method of removing residue from a substrate after a DRIE process

A process for etching semiconductor substrates using a deep reactive ion etching process to produce through holes or slots (hereinafter 'slots') in the substrates. The process includes applying a first layer to a back side of a substrate as a first etch stop material. The first layer is a relatively soft etch stop material. A second layer is applied to the first layer on the back side of the substrate to provide a composite etch stop layer. The second layer is a relatively hard etch stop material. The substrate is etched from a side opposite the back side of the substrate to provide a slot in the substrate.

Multiple layer etch stop and etching method

Growing community of inventors

Georgetown, KY, United States of America

David Bruce Rhine