Elwha LLC

The Invention Science Fund I LLC

Adeia Semiconductor Bonding Technologies Inc.

Microsoft Technology Licensing, LLC

Tokitae LLC

Deep Science, LLC

Tessera LLC

David Bazeley Tuckerman

Roderick A Hyde

Lowell L Wood, Jr

Jordin T Kare

Clarence T Tegreene

Muriel Y Ishikawa

Nathan P Myhrvold

Charles Whitmer

Victoria Y H Wood

Thomas A Weaver

Alistair K Chan

William Henry Gates, Iii

Robert C Petroski

William David Duncan

Philip Andrew Eckhoff

Edward K Y Jung

Hon Wah Chin

Tony S Pan

Jesse R Cheatham, Iii

Bran Ferren

Geoffrey Frank Deane

John Latham

W Daniel Hillis

Howard Lee Davidson

Nicholas F Pasch

Belgacem Haba

Kenneth G Caldeira

Robert W Lord

Richard T Lord

Craig J Mundie

Marc Tremblay

Stephen Hugh Salter

Eric D Rudder

Philip Lionel Barnes

Brian Lee

Kimberly D A Hallman

Jeffrey A Bowers

Giles Humpston

Eric Leuthardt

David R Smith

Paul G Allen

Nathan Kundtz

Russell J Hannigan

Kenneth Allen Honer

Thomas J Nugent, Jr

Masud Beroz

Elizabeth A Sweeney

Steven Nabil Bathiche

Yaroslav Aleksandrovich Urzhumov

John Brian Pendry

Mahalaxmi Gita Bangera

Jaron Zepel Lanier

Max Nathan Mankin

John L Manferdelli

Edward Stuart Boyden

Vage Oganesian

Richard Neil Zare

Stephen L Malaska

Daniel B Cook

Peter L Hagelstein

Michael James Nystrom

Ozgur Emek Yildirim

Philip A Sullivan

Richard Dewitt Crisp

Eric Clarence Peterson

Burton Jordan Smith

Teck-Gyu Kang

Philip Damberg

Benjamin Franklin Cutler

Young-Gon Kim

Richard P Rouse

Alexander Jacques Fleming

Bruce M McWilliams

Peter Johnson

Craig S Mitchell

Tom Driscoll

Dawson Yee

David Schurig

Craig Steven Ranta

Douglas Patrick Kelley

Nicholas W Touran

Michael Warner

Jesse B Thompson

Conor L Myhrvold

Cameron A Myhrvold

Nicholas J Colella

Thomas Foley

Matthew David Turner

Glenn Urbish

Flavio Griggio

Robert Burtzlaff

Charles Liam Goudge

Cliff C Lee

William Gates

Norman Ashton Whitaker, Jr

Willam D Duncan

Kimberly Da Hallman

Thomas Allan Weaver

Jesse R Iii Cheatham

High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.

High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics

One embodiment includes a computer interconnect system. The system includes a first cable comprising a first superconducting signal line formed from a superconductor material to propagate at least one signal and a second cable comprising a second superconducting signal line formed from the superconductor material to propagate the respective at least one signal. The system also includes an interconnect structure configured to contact each of the first and second cable and comprising a third superconducting signal line formed from the superconductor material and configured to propagate the respective at least one signal between the respective first and second superconducting signal line. The system further includes at least one interconnect contact disposed on the first, second, and third at least one superconducting signal line at a contact portion between each of the at least one first and third superconducting signal lines and the at least second and third superconducting signal lines.

Superconductor interconnect system

Methods and structures corresponding to superconducting apparatus including superconducting layers and traces are provided. A method for forming a superconducting apparatus includes forming a first dielectric layer on a substrate by depositing a first dielectric material on the substrate and curing the first dielectric material at a first temperature. The method further includes forming a first superconducting layer comprising a first set of patterned superconducting traces on the first dielectric layer. The method further includes forming a second dielectric layer on the first superconducting layer by depositing a second dielectric material on the first superconducting layer and curing the second dielectric material at a second temperature, where the second temperature is lower than the first temperature. The method further includes forming a second superconducting layer comprising a second set of patterned superconducting traces on the second dielectric layer.

Method of forming superconducting layers and traces

Methods and apparatus are disclosed for cooling superconducting signal lines disposed on an interconnect such as a flexible cable or a rigid substrate. The superconducting signal lines are cooled to a cryogenic temperature lower than the temperature at which at least some superconducting logic devices coupled to the interconnect are operated. In some examples, an airtight conduit, heat pipe, or thermally conduct of strap provided to cool the superconducting interconnect. In one example of the disclosed technology, a system includes at least two sets of superconducting logic devices, cooling apparatus adapted to cool the logic devices to a first operating temperature, and interconnect coupling the superconducting logic devices, and a cooling apparatus in thermal communication with the interconnect. The apparatus is adapted to cool superconducting signal lines on the interconnect to a lower operating temperature than the first operating temperature at which the superconducting logic devices operate.

Reducing losses in superconducting cables

Method of forming superconducting apparatus including superconducting layers and traces

A method of customizing hardware by an end user for a mobile phone is provided. The method includes receiving from an end-user a selection of a mobile phone shell from a set of mobile phone shells, sending to the end-user a subset of interchangeable hardware components having different functions, and receiving from the end-user a selection of at least one hardware component from the subset of interchangeable hardware components. The subset of interchangeable hardware components is generated based on a compatibility between the selected mobile phone shell and the set of available interchangeable hardware components.

Customized hardware selection for a mobile phone

A helmet testing apparatus including a movable member, a sensor coupled to the movable member and configured to acquire compliance data regarding a liner disposed within a shell of a helmet through engagement of the sensor with the liner, and a processing circuit configured to determine a rating for the helmet based on the compliance data and predetermined compliance parameters for the helmet.

Systems and methods for helmet liner evaluation

A system for monitoring a building having one or more microphones coupled to a telephone includes a detector configured to detect a triggering event within the building and transmit an activating signal when the triggering event is detected, and a control module configured to receive the activating signal from the detector. The control module is programmed to activate at least one of the one or more microphones to monitor sound when the activating signal is received.

Systems and methods for monitoring sound during an in-building emergency

Described embodiments include a self-propelled vehicle, method, and system. The self-propelled vehicle includes an autonomous driving system configured to dynamically determine maneuvers operating the vehicle along a route in an automated mode without continuous input from a human driver. The vehicle includes an input device configured to receive a real-time request for a specific dynamic maneuver by the vehicle operating along the route from the human driver. The vehicle includes a decision circuit configured to select a real-time dynamic maneuver by arbitrating between (i) the received real-time request for the specific dynamic maneuver from the human driver and (ii) a real-time determination relative to the specific dynamic maneuver received from the autonomous driving system. The vehicle includes an implementation circuit configured to output the selected real-time dynamic maneuver to an operations system of the vehicle.

Driver training in an autonomous vehicle

An interconnect may have a first end coupled to a superconducting system and a second end coupled to a non-superconducting system. The interconnect may include a superconducting element having a critical temperature. During operation of the superconducting system and the non-superconducting system, a first portion of the interconnect near the first end may have a first temperature equal to or below the critical temperature of the superconducting element, a second portion of the interconnect near the second end may have a second temperature above the critical temperature of the superconducting element, and the interconnect may further be configured to reduce a length of the second portion such that temperature substantially over an entire length of the interconnect is maintained at a temperature equal to or below the critical temperature of the superconducting element.

Thermal management for superconducting interconnects

An automatically adjustable radiofrequency link system includes a radiofrequency transmitter configured to transmit a signal at a frequency of transmission within an extremely high frequency (EHF) band. The system further includes a receiving device configured to receive the transmitted signal and provide feedback to a processing circuit communicatively coupled to the transmitter and the receiving device, wherein the feedback is related to the received signal. The processing circuit is configured to determine required signal properties based on the feedback and determine signal loss properties including an effect of atmospheric absorption, as a function of frequency; determine a modification to the transmitted signal using the signal loss properties and the required signal properties; and adjust the frequency of transmission to obtain a desired transmission signal using the modification.

Automatically adjustable radiofrequency link

A mobile device includes a shell; a first replaceable hardware component received within the shell; and a second replaceable hardware component received within the shell, the second replaceable hardware component configured to receive a wireless power signal from a remote device and convert the power signal into electrical energy usable by the mobile device.

Mobile phone having a wireless power module

A vehicle drivetrain includes a magnetic bearing. The vehicle drivetrain includes a motor configured to provide a rotational driving force. The rotational driving force is received by a shaft, and the magnetic bearing is configured to support the shaft. The shaft is configured to drive a wheel of the vehicle.

Vehicle drivetrain with active magnetic bearings

A turbine blade includes a core element having a base portion, a tip portion, and an intermediate portion extending between the base portion and the tip portion. The intermediate portion includes a non-uniform cross-section and is a high-strength fiber material. The turbine blade further includes a shell disposed around the core element, and the volume between the core element and the shell forms a void.

Dual element turbine blade

Growing community of inventors

Lafayette, CA, United States of America

David Bazeley Tuckerman