Air Products and Chemicals, Inc.

Versum Materials Us, LLC

David Barry Rennie

Madhukar Bhaskara Rao

Gene Everad Parris

Dnyanesh Chandrakant Tamboli

Rajkumar Ramamurthi

Gautam Banerjee

Roberto John Rovito

Dana L Durham

Yi-Chia Lee

Aiping Wu

Rajiv Krishan Agarwal

Terence Collier

Mark Richard Brown

Charles A Lhota

A photoresist or semiconductor manufacturing residue stripping and cleaning composition comprising water, one or more alkaline compounds, one or more corrosion inhibitors, and one or more oxidized products of one or more antioxidants, the method of making the composition and the method of using the composition.

Semi-aqueous photoresist or semiconductor manufacturing residue stripping and cleaning composition with improved silicon passivation

A solution for semiconductor wafer dicing is disclosed. The solution suppresses the adherence of contamination residues or particles, and reduces or eliminates the corrosion of the exposed metallization areas, during the process of dicing a wafer by sawing. The solution comprises at least one organic acid and/or salt thereof; at least a surfactant and/or at least a base; and deionized water, the composition has a pH is equal or greater than 4. The solution can further comprise, a chelating agent, a defoaming agent, or a dispersing agent.

Method for wafer dicing and composition useful thereof

Adherence of contaminant residues or particles is suppressed, corrosion of exposed surfaces is substantially reduced or eliminated during the process of dicing a wafer by sawing. A fluoride-free aqueous composition comprising a dicarboxylic acid and/or salt thereof; a hydroxycarboxylic acid and/or salt thereof or amine group containing acid, a surfactant and deionized water is employed.

Process for inhibiting corrosion and removing contaminant from a surface during wafer dicing and composition useful therefor

A composition for removing etching residue and a method using same are disclosed herein. In one aspect, there is provided a method for removing etching residue from a substrate comprising: contacting the substrate with a composition comprising water, an organic dicarboxylic acid, a buffering agent, a fluorine source, and optionally a water miscible organic solvent.

Compositions for removing etching residue and use thereof

Compositions containing water, an organic dicarboxylic acid, a buffering agent and fluorine source and optionally a water miscible organic solvent are capable of removing etching residue.

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Bethlehem, PA, United States of America

David Barry Rennie