Laird Technologies Gmbh

David B Wood

Karen Bruzda

Baoquan Ou

Troy Dewayne Derksen

Richard Tsai

Disclosed are exemplary embodiments of thermal management and/or EMI (electromagnetic interference) mitigation materials with modified or custom colored exterior surfaces. The thermal management and/or EMI mitigation materials disclosed herein may comprise thermal interface materials (e.g., thermally-conductive pads or gap fillers, thermally-conductive dielectric materials, etc.), EMI shielding materials (e.g., EMI suppression materials, electrically-conductive thermal insulators, EMI absorbers etc.), microwave absorbers (e.g., microwave absorbing elastomers, microwave absorbing foams, EMI/RF/microwave absorbers, etc.), combinations thereof, etc. The thermal management and/or EMI mitigation materials disclosed herein may comprise combined thermal management and EMI mitigation materials, such as hybrid thermal/EMI absorbers, thermally-conductive microwave absorbers, hybrid absorber/thermal management materials usable for EMI mitigation, combined thermal interface and EMI shielding materials (e.g., thermally-conductive and electrically-conductive materials, thermally-conductive and EMI shielding/absorbing materials, etc.), etc.

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St. Louis, MO, United States of America

David B Wood