Honeywell G.m.b.h.

David B Wamstad

Raymond F McMullen

Max C Glenn

Douglas W Wilda

An absolute pressure sensor capsule and sensor resulting therefrom are disclosed. In one preferred embodiment, the capsule includes a sensor die of a first material, an intermediate spacer of a second material joined to the die and a base plate of a third material, the base plate having a variable thickness for changing the span shift, null shift, and static pressure of the die while compensating for changes in the calibration of the electrical die components.

Fluid isolated self-compensating absolute pressure sensor transducer

Disclosed is a pressure transducer package comprising a housing and a substantially cylindrical chamber formed into the housing, a first end of the chamber comprising a substantially flat surface. The package further comprises a substantially cylindrical interface plate having first and second substantially flat end surfaces, one end surface of the interface plate facing the first end surface of the chamber. The package further comprises a pressure transducer comprising a pressure sensitive silicon die mounted to a substantially cylindrical support member. The support member comprises first and second substantially flat end surfaces. The other end surface of the interface plate faces one end surface of the support member. The housing comprises plug apparatus for hermetically sealing the chamber, the plug apparatus having a substantially flat surface forming a second end of the chamber. A compressive ring is located between the other end of the support member and the substantially flat surface of the plug apparatus. The plug apparatus comprises means for compressing the interface plate, pressure transducer, and compressive ring together and toward the first end of the chamber. The housing includes an aperture for connecting the silicon die to a pressure medium.

Pressure transducer package

Disclosed is a pressure transducer comprising a pressure sensitive silicon die having a front side exposing piezoresistive means and a back side for receiving pressure from a pressure medium. The transducer further comprises a pressure vessel having an aperture and apparatus including a hermetic seal for mounting the die with the front side of the die facing the aperture. In this manner, the die is compressed toward the pressure vessel when positive pressure is applied to the back side of the die by the pressure medium.

Pressure transducer

A very high hermeticity glass to metal seal comprising a round cylindrically shaped glass member having an outside diameter; a tubular sleeve of resilient metal having (i) a first end with an inside diameter slightly larger than said outside diameter of said glass member, and (ii) a reduced diameter portion adjacent to said first end thereof with the diameter of said reduced diameter portion being slightly smaller than the outside diameter of the glass member; a thin metalized layer on a first end of the glass member adapted to be inserted into said first end of the tubular metal sleeve so as to define an annular gap therebetween, the glass member being inserted as far as possible into the sleeve so that the end thereof is into abutting relation with said reduced diameter portion of said sleeve so as to form a capillary gap therebetween. Subsequently solder means is flowed, while in a molten form, into said annular gap pursuant to a pulling-like force into said capillary gap thus forming, when said solder means cools, a very high hermeticity glass to metal seal.

Very high hermeticity glass to metal seal

A fluid differential pressure transmitter assembly includes a pressure sensor housing having a spacer within the housing to minimize the internal fill fluid used to conduct fluid pressure from a fluid inlet port to a pressure sensor located within the housing in the form of a pressure responsive diaphragm. Input pressures are applied to respective sides of the diaphragm to produce an electrical signal output representative of the differential pressure from piezoresistive elements deposited on the diaphragm. The sensor is electrically connected by flexible wires to electrically conductive paths supported on an end surface of the spacer. The conductive paths are, in turn, electrically connected to electrode wires at electrically conductive support junctions between the spacer and the electrode wires. However, the spacer is supported on the electrode wires at the support junctions in a free floating arrangement without any other physical contact to either adjacent elements within the housing or the interior wall of the housing. Thus, physical changes to the spacer such as those occasioned by temperature changes are not transmitted to the fluid seals. The electrode wires are arranged to pass through fluid-tight seals in the transmitter housing to provide external electrical connections to the sensor while supporting the spacer within the housing.

Fluid pressure transmitter assembly

A stress sensitive semiconductor die and housing means therefore comprising a ceramic base member having a recessed portion and a shoulder portion around the periphery. A washer-like support member is positioned within the recess, one face of which is bonded to the base member, said support member having a central aperture. A stress sensitive semiconductor die is bonded to the other face of the support member with the center of the die being in substantial register with the aperture in the support member. Finally, cover means are attached to the shoulder portion.

Stress sensitive semiconductor unit and housing means therefor

A stress sensitive semiconductor unit comprising means for supporting a very long elongated cylindrical support member having a stress sensitive semiconductor die bonded to one end thereof, a plurality of metal elongated terminal pins held in rigid hermetically sealed insulative relationship with said header, first and second insulative spacers having central bores sized larger than the outer diameter of the glass tubular member and positioned in axial proximity to one another with the first spacer being abutted against the header and with the second spacer being sized so that the outer axial end thereof is substantially in planer register with the active face of the semiconductor die, the ends of the terminal pins being mechanically and electrically connected to conductive areas or portions on the face of the second spacer.

Growing community of inventors

Roseville, MN, United States of America

David B Wamstad