Nuvosun, Inc.

Dow Global Technolgoies LLC

Conner Peripherals, Inc.

David B Pearce

Dennis R Hollars

Bruce Hachtmann

Thomas M Valeri

Liguang Gong

Robert B Zubeck

Delbert F Waltrip

Arthur C Wall

Robert M Smith

Gary L Payne

Josef Bonigut

Kenneth Lee

Bruce D Hachtmann

An improved method for interconnecting thin film solar cells to form solar cell modules is provided, the method comprising using a flat metallic mesh formed from a thin metallic strip to provide a current collection grid over a thin film solar cell. The method is particularly useful for forming interconnections between thin film solar cells deposited on flexible substrates. The rectangular cross sectional shape of the mesh elements provides an increased area of electrical contact to the solar cell compared to the small tangential area provided by elements of circular cross section. Mesh elements can be made higher rather than wider to improve conductivity without proportionally increasing shading loss. Various coatings can be applied to the mesh to improve its performance, provide corrosion resistance, and improve its cosmetic appearance.

Solar cell interconnection method using a flat metallic mesh

Disclosed is a highly automated method of interconnecting flexible solar cells to form solar modules having a wide variety of sizes and electrical characteristics. The method is fast and economical, providing many attributes of a 'pseudo monolithic integration' scheme that has previously been attainable only on rigid substrates.

Flexible solar cell interconnection systems and methods

An apparatus in accordance with the present invention provides a single or multi-layer coating to the surface of a plurality of substrates. The apparatus may include a plurality of buffer and sputtering chambers, and an input end and an output end, wherein said substrates are transported through said chambers of said apparatus at varying rates of speed such that the rate of speed of a pallet from said input end to said output end is a constant for each of said plurality of pallets. A high throughput sputtering apparatus having a plurality of integrally matched components in accordance with the present invention may further include means for transporting a plurality of substrates through said sputtering chambers at variable velocities; means for reducing the ambient pressure within said sputtering chambers to a vacuum level within a pressure range sufficient to enable sputtering operation; means for heating said plurality of substrates to a temperature conducive to sputtering said coatings thereon, said means for heating providing a substantially uniform temperature profile over the surface of said substrates; and control means for providing control signals to and for receiving feedback input from, said sputtering chambers, means for transporting, means for reducing, and means for heating, said control means being programmable for allowing control over said means for sputtering, means for transporting, means for reducing and means for heating.

Apparatus and method for high throughput sputtering

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Saratoga, CA, United States of America

David B Pearce