Harris Corporation

David B Nicol

Louis Joseph Rendek, Jr

Michael Raymond Weatherspoon

Casey Philip Rodriguez

A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.

Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices

A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.

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Melbourne, FL, United States of America

David B Nicol