Smiths Aerospace, Inc.

David B Hartung

Brian G Krug

The power conversion system allows for multiple segregated and ground independent power sources to provide redundant power to modules within an electronics equipment cabinet with increased reliability and reduced sensitivity to common fault propagation. The power conversion system provides power conditioning modules having independent supply rails that supply power to each module within an electronics equipment cabinet. FET and diode solid-state control and driver logic enable each individual supply rail. Efficient power distribution is facilitated by primary and hot-backup operation of one or more power conditioning modules. Power conversion is facilitated by one or more input supply power feeds and one or more converter stages.

System for high reliability power distribution within an electronics equipment cabinet

An air cooling apparatus for an aircraft includes a cabinet that is configured to house a plurality of modules in a plurality of module accepting regions, respectively, wherein the cabinet has a backplane region. The apparatus further includes a plurality of air flow passages provided between adjacent ones of the respective module accepting regions of the cabinet. The apparatus also includes a primary air flow unit for providing primary air flow from the backplane region and through the plurality of air flow passages, to thereby cool the plurality of modules housed within the cabinet.

Method for electronics equipment cooling having improved EMI control and reduced weight

An electronic assembly cooling system including a module case assembly that has a module case wall. The system includes a first and second air driver and an electronic assembly located in-front of the module case wall. The system conducts thermal energy from the electronic assembly from in-front of the module case wall to in-back of the module case wall, and directs air driven by the first air driver past the module case wall in-front of the module case wall to cool the electronic assembly via convective heat transfer. The system directs air driven by the second air driver past the module case wall in-back of the wall to transfer the thermal energy conducted from the electronic assembly from in-front of the module case wall to in-back of the module case wall to the air driven by the second air driver via conductive heat transfer to cool the electronic assembly.

Growing community of inventors

Belmont, MI, United States of America

David B Hartung