Westinghouse Electric Corporation

Ciena Corporation

United States of America As Represented by the Secretary of the Air Force

Pulse Electronics Gmbh

David B Harris

Robert A Bourdelaise

David R King

Denise B Harris

Andrew J Piloto

Timothy M Fertig

Edward Joseph Jablonski

Michael Stephen Brown

Kevin A Leahy

Terrence Michael McGill, Sr

Curtis Keys

Richard G Naedel

Thomas Alan Walter

Lou Rodriguez

John A Olenick

Victor J Brzozowski

Scott P Karr

Richard Hobbs

Stephen J Reinhart

John G McKinley, Iv

Roald N Horton

Keith W Sparks

Guy N Hurst

Mark Uehling

Richard L Anderson, Jr

In various exemplary embodiments, the present invention provides improved card guide and heatsink assemblies for pluggable electro-optic modules utilized in optical communications networks and the like. More specifically, the present invention provides a solderable surface-mounted card guide assembly and a staggered heatsink assembly. These assemblies are utilized with small-form factor pluggable electro-optic modules and the like, and the concepts presented herein can be extended to XFP, XENPAK, XPAK, and X2 electro-optic modules, for example. The solderable surface-mounted card guide assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules not utilizing any type of module cage, while the staggered heatsink assembly of the present invention finds particular applicability with small-form factor pluggable electro-optic modules both not utilizing and utilizing any type of module cage.

Card guide and heatsink assemblies for pluggable electro-optic modules

The present invention provides highly efficient system level EMI filtering in a dual feed Power Distribution Unit (PDU) using custom designed magnetic components that are uniquely designed to provide excellent performance under various load conditions. The PDU of the present invention includes filters for providing the necessary EMI filtering at all frequencies in the range between 200 Hz and 200 MHz under all load conditions including a single feed failure. Additionally, the present invention provides mechanisms for cooling EMI components using a combination of natural convection and conduction techniques at the board level to ensure no loss of EMI filtering performance. The present invention also includes blank panels made of formed Aluminum alloy sheet metal pieces or the like to direct air flow to components on printed wiring boards (PWB's) using air director plates.

Telecom power distribution unit with integrated filtering and telecom shelf cooling mechanisms

The present disclosure provides a cable connector interface stabilization system, including: a component; one or more cables coupled to the component through one or more connectors; a spacer block disposed adjacent to the one or more connectors; and a retention member disposed adjacent to the one or more connectors opposite the spacer block and selectively secured to the spacer block, thereby securing the one or more connectors, and thereby securing the one or more cables to the component. The spacer block disposed adjacent to the one or more connectors is attached to one of a board and a heatsink assembly. The spacer block and the retention member surround the one or more connectors. The spacer block and the retention member secure the one or more connectors and secure the one or more cables to the component such that the associated connector-to-component interface(s) are fixed and immovable, ensuring that the associated electrical parameter(s) remain constant over time.

High speed radio frequency cable connector interface stabilization systems and methods

Disclosed herein are fiber optic cable clips for securing and routing fiber optic cables on a printed circuit board (PCB) or other component used in the communications field. One fiber optic cable clip includes a U-shaped body connected to attachment legs that permanently connect to the PCB. The U-shaped body defines a containment area for receiving and retaining fiber optic cables. The U-shaped body also includes spring-loaded arms or pads that flex open to permit entrance of the fiber optic cables into the containment area, and flex close to retain the cables therein. The fiber optic cable clips retain multiple cables, are easy to use, and do not damage the cables when installing the cables within the clip. If the fiber optic cables are pulled when contained within the clip, the fiber optic cable clips will flex and release the cable before the cables are damaged. The attachment legs permanently connect to the PCB by soldering them to a metallic pad provided on the PCB using surface mount technology (SMT) techniques, which reduces processing time and costs, and prevents, additional potentially damaging PCB processing steps.

Fiber optic cable clip

A connect and disconnect assembly for connecting and disconnecting a laser diode having leads to a printed circuit board (PCB). The assembly includes a heatsink that connects with the printed circuit board by providing cap screws through the PCB which are threadably received in spacers connected to the heatsink. A connection assembly made up of a retainer block and screws connects the laser diode to the heatsink. The laser diode is provided through a cutout portion of the PCB, and connects to the heatsink by providing the screws through the retainer block and the laser diode, the screws being threadably received in the heatsink. A pair of fuzz button carriers are interposed between the laser diode and the PCB. Each fuzz button carrier has a body portion, spaced guide portions extending above the body portion, and fuzz buttons extending through the body portion. When the laser diode is connected to the heatsink, the laser diode leads are provided between the guide portions of the fuzz button carriers and contact the fuzz buttons. The fuzz buttons, in turn, electrically connect the laser diode leads to the PCB pads. The assembly provides a convenient mechanism for connecting/disconnecting the laser diode and heatsink to/from the PCB. Further, the laser diode and assembly can be easily disconnected from the PCB so that a modified, repaired, and/or updated laser diode or other component can be quickly and easily inserted into the circuit without damaging or destroying the laser diode or the PCB.

Solderless laser assembly

A computer and a chassis construction for a computer for severe environmental conditions enclosing a plurality of circuit cards and a power supply includes a sealed, airtight, watertight, metal enclosure having a plurality of integrally joined walls, a first of the plurality of walls having a removable plate for access to the printed circuit cards and the power supply accommodated in the enclosure. The computer for use in a severe environment includes a plurality of printed circuit boards and a power supply and a metal enclosure having a plurality of walls, a top cover and a bottom plate, the enclosure being integrally formed to form an airtight seal along abutting edges thereof. One of the walls has a removable plate and the enclosure is formed of metal. A mechanism is provided for preventing ingress of foreign substances in the enclosure. The mechanism includes a device for shielding the interior of the enclosure from electromagnetic interference (EMI). The computer preferably includes a personal computer-based architecture formed by the plurality of printed circuit boards and the power supply. The sealed enclosure is preferably adapted to meet Aeronautical Radio Incorporated (ARINC) 404 and 600 form factors. A thermal mechanism is provided for a direct thermal path from the printed circuit board components to a chassis sidewall. Such a thermal mechanism and resulting direct thermal path advantageously maximize the use of the sealed enclosure in severe environments.

Chassis and personal computer for severe environment embedded

A packaging system for a standard electronic module is provided utilizing a multi-layer, low temperature, co-fired ceramic motherboard. Device packages, such as an RF device package, are formed of low temperature, low dielectric, co-fired ceramic materials. The device packages are mounted on a composite heat sink provide on one side of the motherboard. A pressure plate provide on the opposite side of the motherboard is fastened to the heat sink to compress the device package. Pressure contact interconnects are used to make contacts between the device packages and the particular conductor layer in the multilayer motherboard. The radio frequency conductor layer in the motherboard is isolated from power and control layers by ground planes provided in the motherboard.

Packaging system for a standard electronic module

Both a system and method is provided for implementing a wiring change with respect to an electrical component detachably connected to a solderless PWB module. The system comprises at least one unused via on the PWB, an insulator used for electrically disconnecting a selected contact pad of the component from a contact pad disposed on the PWB, and a metallic strip mounted on a substrate for electrically connecting the selected component contact pad to the unused via. In one embodiment of the system, the substrate used to support the conductive strip is the compliant, insulative sheet material used in the interface that normally interconnects the pads of the electrical component with the pads of the PWB module. Alternatively, a separate 'smart' layer formed from a thin insulative sheet material may be used to support the conductive strip. The 'smart' layer has an array of conductive regions disposed through its thickness which maintains the contact between the pads of the PWB and the pads of the electrical component. However, when a change is desired, these conductive areas may be abraded off, and a copper strip connector may be provided on the surface of the 'smart' layer between the disconnected component contact pad and an unused via by conventional photo-resist techniques.

System and method for implementing wiring changes in a solderless

The difficulty with integrating packaged devices into a dual composite module design for wafer scale devices is the height difference between the WSI and packaged devices a typical wafer scale device is 0.025 (in) high while typical packaged VLSI components are 0.080 (in) or more. This leaves little room for the other 5 layers of interconnect boards and PCI layers required for the dual composite module. The solution is that the PWB on the side of the composite heat sink has been shortened to support only the wafer scale device on the heat sink. This eliminated PWB thickness and PCI interfaces from the side with the VLSI components. Also 3-P connectors are made with a pressure contact interconnecting (PCI) board.

VLSI integration into a 3-D WSI dual composite module

Both a system and a method are provided for electrically and mechanically connecting at least one integrated circuit die to a solderless printed wiring board of the type which uses connecting interfaces which include an array of resilient electrical connector means held within a sheet of compliant, insulating material. The system of the invention generally comprises a fanout interface formed from a sheet of insulating material integrally connected to the side of an integrated circuit die that includes the bond pads associated with such dies, wherein the fanout interface includes an internal array of contact pads that are connected to the bond pads of the die, and an external array of contact pads on its exterior surface which are advantageously spaced farther apart than the bond pads of the die. The system further comprises a connecting interface having an array of resilient electrical connectors disposed between the external surface of the fanout interface of the die, and an array of contact pads mounted directly on the printed wiring board. Finally, a screw-type heat conductive retainer is provided in order to compress the resilient electrical connectors of the connecting interface into conducting engagement between the contact pads on the fanout interface and the printed wiring board.

System for connecting integrated circuit dies to a printed wiring board

The invention is an improved chip carrier assembly utilizing a cavity-down chip carrier with a pad grid array wherein the IC chip within the chip carrier is mounted against a surface opposite the PWB to which the chip carrier is attached such that heat transfer from the IC chip may occur along a short path to a heat sink such that a large heat transfer rate is possible. Furthermore, the apparatus utilizes an alignment and electrical connection means between the contact pads of the chip carrier and a PWB to which the chip carrier is attached to compensate for shrinkage variation which occurs during the chip carrier fabrication process. Furthermore, within the cavity of the chip carrier there is space for additional components such as a decoupling capacitors. This permits the design of an apparatus providing better heat transfer properties, more accurate contact pad locations and the option of including within the chip carrier components which in the past had been mounted outside of the chip carrier.

Cavity-down chip carrier with pad grid array

The invention is a fine line electrical cable with two ends having a plurality of first conductor lines in a plane. The lines of the cable are embedded in an insulating laminate material, are closely spaced at one end to be compatible with the closely spaced contacts from IC chips and are fanned out along the length of the cable to the other end where the lines are spaced somewhat apart and compatible with conventional electrical connectors. Contact posts extent from each line end so that external connections may be made with the IC chips and the conventional connectors. At least one second conductor line may be embedded within the other side of the laminate material and appropriate contact posts extend from the line ends so that external connections may also be made at these locations. A method for fabricating the fine line elecrical cable is also disclosed.

Ultra fine line cable and a method for fabricating the same

A solderless printed wiring board module for receiving and securing surface mounted solderless electronic component carrier and electronic components without carrier upon a printed wiring board, the module also providing a heat transfer path to a surface away from the printed wiring board and the module further adaptable to electrical and mechanical attachment to similar modules placed adjacent to said module to form a multi-module assembly.

Growing community of inventors

Columbia, MD, United States of America

David B Harris