International Business Machines Corporation

The Carborundum Company

Other

David B Goland

Subhash Laxman Shinde

Lester W Herron

Benjamin V Fasano

Jon Alfred Casey

Robert Hannon

Gregory M Johnson

Andrew Michael Reitter

Carla Natalia Cordero

Rao Venkateswara Vallabhaneni

Dudley A Chance

Lisa M Studzinski

John Ulrich Knickerbocker

David Clifford Long

Mark J LaPlante

Niranjan Mohanlal Patel

Jonathan H Harris

Richard A Bates

Robert A Youngman

Ho-Ming Tong

Kevin M Prettyman

Keith C O'Neil

Candace A Sullivan

Daniel S Mackin

Cynthia J Calli

Kathleen Mary McGuire

Darren T Cook

Joseph Christopher Saltarelli

Michael Thomas Puchalski

Lawrence Alfred Clevenger

Louis L Hsu

David L Edwards

Sushumna Iruvanti

Joseph Francis Shepard, Jr

Raed A Sherif

Giulio DiGiacomo

David J Womac

Richard A Shelleman

Stephen S Drofitz, Jr

Larry D Gross

Gareth Geoffrey Hougham

Krishna Gandhi Sachdev

James N Humenik

Thomas Edward Lombardi

Srinivasa S Reddy

Donald Rene Wall

Dinesh Gupta

Dale Curtis McHerron

Robert J Sullivan

Timothy Rea Dinger

Evan Ezra Davidson

James Robert Wylder

David P Lapotin

A method and structure to form a conductive pattern on a ceramic sheet deposits a photosensitive conductive material on a carrier and exposes a pattern of x-ray energy on the material and sinters the carrier and the material to the ceramic sheet so that only the conductive pattern of the material remains on the ceramic sheet. The structure has a conductive patterned material which includes a photosensitive agent.

X-ray printing personalization technique

A multi-chip module and heat-sink cap assembly and method of fabrication, which provides sufficient cooling for higher power density chips. The heat-sink cap has heat-sink columns disposed over each chip on a substrate. The heat-sink columns are interconnected by flexible members to provide a unitary cover. Thin film metallization of at least a portion of the mating surfaces of the substrate, chips and heat-sink column permits soldering of the cap to the chips and substrate to form the package which is a mechanically stable structure with no degradation of interconnection fatigue life due to thermal cycling of the assembly when in use.

Multi-chip module and heat-sink cap combination

A method for making small punches by employing multi-layer ceramic (MLC) technology includes the steps of preparing a sublaminate matrix of a high or low sintering temperature material, drilling holes in the sublaminate using a mask as a guide, filling the holes with punch material paste by a solupor process, laminating the sublaminate to a base plate or as a freestanding substrate, firing a laminate at an appropriate sintering temperature and removing the matrix material by a chemical or mechanical method. In accordance with the present invention, a large number of small punches are made in parallel to precise dimensions of two to ten mils in diameter and approximately 100 mils in length. This method allows that a punch plate array can also be used to simultaneously punch an array of vias in a greensheet and eliminates the additional step of loading individual punches into a punch plate, offering cost and time savings.

Method for making punches using multi-layer ceramic technology

Electronic packages made with a high area percent coverage of blanket metal may be prone to certain kinds of ceramic defects. In aluminum nitride, these defects may be related to decomposition of the liquid sintering aid. In this experiment, unique additions to the metallization prevented the formation of certain ceramic defects. Our approach involves a unique composition used in an existing process.

Method for the controlling of certain second phases in aluminum nitride

A method to repair Aluminum Nitride (AlN) substrates is disclosed wherein a frequency doubled Q-switched Nd:YAG laser is used to remove unwanted metallurgy. The substrate is place in a liquid filled work chamber which acts to prevent metallic species of AlN from forming. The repair site can be sealed with a novel polymer coating to prevent contamination or corrosion. Repairs can be made to buried or surface metallurgy.

Repair process for aluminum nitride substrates

Method for controlling of certain second phases in aluminum nitride

A multilayer ceramic substrate electronic component is provided having high temperature superconductor material circuitry. The high temperature superconductor material is preferably yttrium-barium-copper-oxide and is encased within a noble metal such as silver or gold when forming the surface circuitry or filling of the vias. The noble metal layers preferably have through-openings to enable direct connection of circuitry to the encased superconductor layer. A method is also provided for fabricating such multilayer ceramic substrate electronic components.

Multi-layer glass ceramic module with superconductor wiring

Multi-layer ceramic substrate having high TC superconductor circuitry

Multi-chip heat-sink cap assembly

A method and apparatus for flattening a ceramic body comprised primarily of an aluminum nitride system having a liquid phase additive necessary for low temperature sintering during a firing thereof is disclosed. The ceramic body is referred to as an aluminum nitride multilayer ceramic (AlN MLC). The method and apparatus include a support tile having a first coating on a contact surface thereof, the AlN MLC for being placed upon the contact surface of the support tile. A load flattening tile having a second coating on a contact surface thereof is provided, the load flattening tile for being placed with its coated surface upon and in contact with the AlN MLC. Lastly, a furnace is provided for heating the support tile, AlN MLC, and load flattening tile at temperatures greater than 1500.degree. C. for an amount of time necessary to flatten the ceramic body to a desired degree of flatness, wherein the first coating and the second coating of the support tile and the load flattening tile, respectively, react with the AlN MLC for quenching the liquid phase of the ceramic body to prevent a sticking of the support tile and the load flattening tile to the AlN MLC during a flattening process.

Method for flat firing aluminum nitride/tungsten electronic modules

The present invention relates generally to a new apparatus and method for screening using electrostatic adhesion. More particularly, the invention encompasses an apparatus that uses an electrostatic charge during the screening process for a semiconductor substrate. Basically, a backing layer is adhered to a green ceramic sheet using an electrostatic charge, while the green ceramic sheet is processed.

Apparatus and method for screening using electrostatic adhesion

Disclosed is an aluminum nitride body having graded metallurgy and a method for making such a body. The aluminum nitride body has at least one via and includes a first layer in direct contact with the aluminum nitride body and a second layer in direct contact with, and that completely encapsulates, the first layer. The first layer includes 30 to 60 volume percent aluminum nitride and 40 to 70 volume percent tungsten and/or molybdenum while the second layer includes 90 to 100 volume percent of tungsten and/or molybdenum and 0 to 10 volume percent of aluminum nitride.

Aluminum nitride body having graded metallurgy

The present invention relates generally to a new apparatus and method for screening using porous backing material. More particularly, the invention encompasses an apparatus that uses a porous backing material which is adhered to a green sheet during the screening process. Basically, a backing layer having a very high porosity is adhered to a green sheet, while the green sheet is screened. During the drying process of the green sheet some of the screening fluids are absorbed by the porous backing layer, which allows the screened vias of the green sheet to have a smooth surface.

Apparatus and method for screening green sheet with via hole using

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New Paltz, NY, United States of America

David B Goland