Motorola Corporation

David B Fiedler

David W Currier

Robert A Johnson

James V Lowery

Horace M Long

Agustin O Morin

A method and apparatus for bending a substantially rigid substrate () having first and second portions () interconnected by a bend region (). The apparatus comprises first and second heated die members (). The first heated die member () has a longitudinal body portion () and an outer edge portion () that extends along the longitudinal body portion () and is substantially rounded. The second heated die member () has a longitudinal body portion () and a groove () that extends along the longitudinal body portion (). The first and second heated die members () are configured to contact the substrate () and are capable of bending the substrate () in the bend region () when the outer edge portion () of the first heated die member () slides into the groove () of the second heated die member (). There is also a method for bending the substantially rigid substrate ().

System and method for bending a substantially rigid substrate

A method and apparatus for spring mounting of multi-layered electronic assemblies including a top cover; a bottom cover; first, second, and third mounting supports; a printed wiring board in contact with and supported by the first, second and third mounting supports at first, second, and third mounting locations, respectively; springs for clamping the multi-layered electronic assembly between the top cover and the bottom cover; a load plate for supporting the assembly, the load plate including fourth, fifth, and sixth mounting supports aligning with the first, second, and third mounting locations, respectively, and in contact with the springs; and the top cover contacting the load plate and coupled to the bottom cover, wherein the coupling of the top cover and bottom cover compresses the springs and securely clamps the multi-layered electronic assembly within the top and bottom covers.

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New Braunfels, TX, United States of America

David B Fiedler